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µPD43256B

Recommended Soldering Conditions

The following conditions (See table below) must be met when soldering

µPD43256B. For more details, refer

to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL” (C10535E).

Please consult with our sales offices in case other soldering process is used, or in case soldering is done

under different conditions.

Types of Surface Mount Device

µPD43256BGU: 28-pin plastic SOP (450 mil)

µPD43256BGW-9JL: 28-pin plastic TSOP (I) (8 × 13.4 mm) (Normal bent)

µPD43256BGW-9KL: 28-pin plastic TSOP (I) (8 × 13.4 mm) (Reverse bent)

Please consult with our sales offices.

Type of Through Hole Mount Device

µPD43256BCZ: 28-pin plastic DIP (600 mil)

Soldering process

Soldering conditions

Wave soldering

Solder temperature: 260 ˚C or below,

(only to leads)

Flow time: 10 seconds or below

Partial heating method

Terminal temperature: 300 ˚C or below,

Time: 3 seconds or below (Per one lead)

Caution Do not jet molten solder on the surface of package.