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LT1010

1010fe

ELECTRICAL CHARACTERISTICS The

denotes the specifications which apply over the full operating

temperature range, otherwise specifications are at TA = 25°C. (See Note 4. Typical values in curves.)

SYMBOL

PARAMETER

CONDITIONS (Note 4)

MIN

TYP

MAX

UNITS

VOS

Output Offset Voltage

(Note 4)

–20

150

220

VS = ±15V, VIN = 0V

100

Input Bias Current

IOUT = 0mA

IOUT ≤ 150mA

250

500

800

µA

Large-Signal Voltage Gain

0.995

1.00

V/V

ROUT

Output Resistance

IOUT = ±1mA

IOUT = ±150mA

Slew Rate

VS = ±15V, VIN = ±10V, VOUT = ±8V, RL = 100Ω

V/µs

VSOS+

Positive Saturation Offset

IOUT = 0 (Note 5)

1.0

1.1

VSOS–

Negative Saturation Offset

IOUT = 0 (Note 5)

0.2

0.3

RSAT

Saturation Resistance

IOUT = ±150mA (Note 5)

VBIAS

Bias Terminal Voltage

RBIAS = 20Ω (Note 6)

700

560

840

880

Supply Current

IOUT = 0, IBIAS = 0

Note 1: Stresses beyond those listed under Absolute Maximum Ratings

may cause permanent damage to the device. Exposure to any Absolute

Maximum Rating condition for extended periods may affect device

reliability and lifetime.

Note 2: Dissipation must be based on a thermal resistance. See

Application Information for power dissipation.

Note 3: In current limit or thermal limit, input current increases sharply

with input-output differentials greater than 8V; so input current must be

limited. Input current also rises rapidly for input voltages 8V above V+ or

0.5V below V–.

Note 4: Specifications apply for 4.5V ≤ VS ≤ 40V,

V– + 0.5V ≤ VIN ≤ V+ – 1.5V and IOUT = 0, unless otherwise stated.

Temperature range is 0°C ≤ TC ≤ 100°C.

Note 5: The output saturation characteristics are measured with 100mV

output clipping. See Applications Information for determining available

output swing and input drive requirements for a given load.

Note 6: The output stage quiescent current can be increased by connecting

a resistor between the BIAS pin and V+. The increase is equal to the bias

terminal voltage divided by this resistance.

Note 7: Thermal resistance varies depending upon the amount of PC board

metal attached to the pin (Pin 9) of the device.

θJA is specified for a certain

amount of 1oz copper metal trace connecting to Pin 9 as described in the

thermal resistance tables in the Applications Information section.

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