µPD6121, 6122

23

11.

RECOMMENDED SOLDERING CONDITIONS

The following conditions (see table below) must be met when soldering this product.

For more details, refer to the NEC document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY

MANUAL (IEI-1207).

Please consult an NEC sales representative in case an other soldering process is used, or in case soldering

is done under different conditions.

Table 11-1. Soldering Conditions for Surface Mounting

µPD6121G-001: 20-pin plastic SOP (375 mil)

µPD6121G-002: 20-pin plastic SOP (375 mil)

µPD6122G-001: 24-pin plastic SOP (375 mil)

µPD6122G-002: 24-pin plastic SOP (375 mil)

Soldering Process

Soldering Conditions

Symbol

Infrared ray reflow

Peak temperature of package surface: 230

°C,

IR30-00-1

Reflow time: 30 seconds or less (210

°C or higher),

Number of reflow processes: 1

VPS

Peak temperature of package surface: 215

°C,

VP15-00-1

Reflow time: 40 seconds or less (200

°C or higher),

Number of reflow processes: 1

Wave soldering

Solder temperature: 260

°C or lower,

WS60-00-1

Reflow time: 10 seconds or less, Number of reflow processes: 1

Preheat temperature: 120

°C or lower (at package surface)

Partial heating

Pin temperature: 300

°C or lower,

—

Time: 3 seconds or less (per device side)

Caution

Do not apply more than one soldering method at any one time, except for the partial heating

method.

*