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AN3960 Datasheet(PDF) 11 Page - STMicroelectronics

Part # AN3960
Description  ESD considerations for touch sensing applications
PDF  21 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

AN3960 Datasheet(HTML) 11 Page - STMicroelectronics

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AN3960
Protecting against ESD
Doc ID 022082 Rev 1
11/21
Use of the dielectric overlay is effective and is almost mandatory for many applications
however, there are some drawbacks, namely that the overlay does not surround the whole
application and that an ESD event can bypass the overlay. If the user can avoid accessing
the application through the front panel (example, by accessing it from the back or
elsewhere) or if the ESD event can bypass the front panel, one of the other methods which
protect the device against an ESD event should be considered.
3.2
Spark gaps
Physical techniques, such as the addition of spark gaps, can give supplementary protection
to the input/output lines of a circuit board which are susceptible to extraneous voltage such
as ESD. For example, printed circuit board (PCB) spark gaps can be used to route ESD to
earth in products using capacitive sensing electrodes (see Figure 3: PCB with spark gap).
A spark gap consists of an arrangement of two conducting electrodes separated by a gap
usually filled with a gas such as air which is designed to allow an electric spark to pass
between the conductors. When the voltage difference between the conductors exceeds the
gap's breakdown voltage, a spark forms, ionizing the gas and drastically reducing its
electrical resistance.
The spark gap shown in Figure 3 is an 8 mm gap which is a common PCB tolerance. The
approximate breakdown of such a small spark gap is given in Equation 1.
Table 2.
Dielectric overlay materials and their dielectric strength
Material
Breakdown voltage(1)
(V/mm)
1.
The breakdown voltage of an insulating material is the minimum voltage that causes a portion of the
insulator to become electrically conductive.
Min. overlay thickness at 12 kV
(mm)
Air
1200–2800
10
Dry wood
3900
3
Common glass
7900
1.5
Borosilicate glass, e.g. Pyrex®
13000
0.9
Polymethyl methacrylate
(PMMA) plastic, e.g. Plexiglas®
13000
0.9
Acrylonitrile butadiene styrene
(ABS) plastic
16000
0.8
Polycarbonate, e.g. Lexan®
16000
0.8
Formica plastic
18000
0.7
FR-4(2)
2.
FR-4 is a widely accepted international grade deignation for fiberglass reinforced epoxy laminates that are
flame retardant.
28000
0.4
Polyethylene terephthalate
(PET) film, e.g. Mylar®
280000
0.04
Polymide film, e.g. Kapton®
280000
0.04



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