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UPD72001C Datasheet(PDF) 36 Page - NEC

Part # UPD72001C
Description  MULTI-PROTOCOL SERIAL CONTROLLERS
PDF  40 Pages
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Manufacturer  NEC [NEC]
Direct Link  http://www.nec.com/
Logo NEC - NEC

UPD72001C Datasheet(HTML) 36 Page - NEC

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µPD72001-11, 72001-A8
36
5. RECOMMENDED SOLDERING CONDITIONS
It is recommended to solder this product under the following conditions.
For details on the recommended soldering conditions, refer to Information Document Semiconductor Device
Mounting Technology Manual (C10535E).
For soldering methods and conditions other than those recommended, consult NEC.
Surface mount type
•
µPD72001G-11-22 : 44-pin plastic QFP (10 × 10 mm)
µPD72001G-A8-22: 44-pin plastic QFP (10 × 10 mm)
Soldering Method
Soldering Condition
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°C, Time: 30 seconds MAX.
IR35-107-2
(210
°C MIN.), Number of times: 2 MAX., Number of days: 7Note
(After that, prebaking for 10 hours at 125
°C is necessary.)
<Precaution>
Products other than in heat-resistance trays (such as those packaged
in a magazine, taping, or non-heat-resistance tray) cannot be baked
while they are in their package.
VPS
Package peak temperature: 215
°C, Time: 40 seconds MAX.
VP15-107-2
(200
°C MIN.), Number of times: 2 MAX., Number of days: 7Note
(After that, prebaking for 10 hours at 125
°C is necessary.)
<Precaution>
Products other than in heat-resistance trays (such as those packaged
in a magazine, taping, or non-heat-resistance tray) cannot be baked
while they are in their package.
Wave soldering
Solder bath temperature: 260
°C MAX., Time: 10 seconds MAX.,
WS60-107-1
Number of times: 1, Preheating temperature: 120
°C MAX.
(package surface temperature), Number of days: 7Note
(After that, prebaking for 10 hours at 125
°C is necessary.)
<Precaution>
Products other than in heat-resistance trays (such as those packaged
in a magazine, taping, or non-heat-resistance tray) cannot be baked
while they are in their package.
Partial heating
Pin temperature: 300
°C MAX., Time: 3 seconds MAX.
—
(per side of device)
Note The number of days the product can be stored at 25
°C, 65 % RH MAX. after the dry pack has been opened.
Caution Do not use two or more soldering methods in combination (except partial heating).



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