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LT1512CS8 Datasheet(PDF) 9 Page - Linear Technology |
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LT1512CS8 Datasheet(HTML) 9 Page - Linear Technology |
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9 / 12 page ![]() 9 LT1512 charging current. Maximum diode reverse voltage will be equal to input voltage plus battery voltage. Diode reverse leakage current will be of some concern during charger shutdown. This leakage current is a direct drain on the battery when the charger is not powered. High current Schottky diodes have relatively high leakage cur- rents (2 µA to 200µA) even at room temperature. The latest very-low-forward devices have especially high leakage cur- rents. It has been noted that surface mount versions of some Schottky diodes have as much as ten times the leakage of their through-hole counterparts. This may be because a low forward voltage process is used to reduce power dissipation in the surface mount package. In any case, check leakage specifications carefully before making a final choice for the switching diode. Be aware that diode manufacturers want to specify a maximum leakage current that is ten times higher than the typical leakage. It is very difficult to get them to specify a low leakage current in high volume production. This is an on going problem for all battery charger circuits and most customers have to settle for a diode whose typical leakage is adequate, but theoretically has a worst-case condition of higher than desired battery drain. Thermal Considerations Care should be taken to ensure that worst-case conditions do not cause excessive die temperatures. Typical thermal resistance is 130 °C/W for the S8 package but this number will vary depending on the mounting technique (copper area, air flow, etc). Average supply current (including driver current) is: ImA VI V IN BAT CHRG IN =+ 4 0 024 ()( )( . ) Switch power dissipation is given by: P IR V V V V SW CHRG SW BAT IN BAT IN = + () ( )( )( ) () 2 2 RSW = output switch ON resistance Total power dissipation of the die is equal to supply current times supply voltage, plus switch power: PD(TOTAL) = (IIN)(VIN) + PSW APPLICATIONS INFORMATION For VIN = 10V, VBAT = 8.2V, ICHRG = 0.5A, RSW = 0.65Ω IIN = 4mA + 10mA = 14mA PSW = 0.24W PD = (0.014)(10) + 0.24 = 0.38W The S8 package has a thermal resistance of 130 °C/W. (Contact factory concerning 16-lead fused-lead package with footprint approximately same as S8 package and with lower thermal resistance.) Die temperature rise will be (0.38W)(130 °C/W) = 49°C. A maximum ambient tempera- ture of 60 °C will give a die temperature of 60°C + 49°C = 109 °C. This is only slightly less than the maximum junction temperature of 125 °C, illustrating the importance of doing these calculations! Programmed Charging Current LT1512 charging current can be programmed with a PWM signal from a processor as shown in Figure 5. C6 and D2 form a peak detector that converts a positive logic signal to a negative signal. The average negative signal at the input to R5 is equal to the processor VCC level multiplied by the inverse PWM ratio. This assumes that the PWM signal is a CMOS output that swings rail-to-rail with a source resis- tance less than a few hundred ohms. The negative voltage is converted to a current by R5 and R6 and filtered by C7. This current multiplied by R4 generates a voltage that subtracts from the 100mV sense voltage of the LT1512. This is not a high precision technique because of the errors in VCC and the diode voltage, but it can typically be used to adjust charging current over a 20% to 100% range with good repeatability (full charging current accuracy is not affected). To reduce the load on the logic signal, R4 has been increased C6 1 µF C7 10 µF C4 0.22 µF R3 1512 F05 L1B IFB LT1512 R5 4.02k PWM INPUT ≥1kHz D2 R6 4.02k R4 200 Ω + Figure 5. Programming Charge Current |
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