SGA8343Z datasheet(4/13 Pages) RFMD

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DS110620

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SGA8343Z

Recommended PCB Layout

Use multiple plated-thru via holes located close to the package pins to ensure a good RF ground connection to a continuous

groundplane on the backside of the board.

Typical Performance - Noise Parameters - 3V, 10mA

Frequency

(GHz)

NFMIN

(dB)[5]

OPT

Mag<Ang

(

)

GMAX

(dB)

0.9

0.94

0.10<55

0.11

23.88

1.9

1.1

0.71<125

0.10

19.33

2.4

1.18

0.25<157

0.09

17.66

1.27

0.23<179

0.09

15.01

1.5

0.29<-150

0.12

11.94

1.73

0.42<-122

0.18

9.84

2.02

0.55<-110

0.24

8.62

[5] ZS=OPT, ZL=ZL*, NFMIN is a noise parameter for which the input matching circuit losses have been de-embedded. The

noise parameters were measured using a Maury Microwave Automated Tuner System. The device was mounted on a 0.010”

PCB with plated-thru holes close to pins 2 and 4.

Function

Description

1BASE

RF input/base pin.

2, 4

EMITTER

Connection to ground. Use multiple via holes to reduce emitter inductance.

COLLECTOR RF output/collector bias.

SOT-343

Package

Plated Thru

Holes

(0.020" DIA)

Ground

Plane

SGA8343Z Datasheet(PDF) 4 Page - RF Micro Devices

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