ISO7841F datasheet(16/31 Pages) TI

16 / 31 page

ISO7841, ISO7841F

SLLSEM3C – NOVEMBER 2014 – REVISED JULY 2015

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8.3 Feature Description

PRODUCT

CHANNEL DIRECTION

RATED ISOLATION

MAX DATA RATE

DEFAULT OUTPUT

3 Forward,

ISO7841

5700 VRMS / 8000 VPK

(1)

100 Mbps

High

1 Reverse

3 Forward,

ISO7841F

5700 VRMS / 8000 VPK

(1)

100 Mbps

Low

1 Reverse

(1)

See Regulatory Information for detailed isolation ratings.

8.3.1 High Voltage Feature Description

8.3.1.1 Package Insulation and Safety-Related Specifications

over recommended operating conditions (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Shortest terminal-to-terminal distance

L(I01)

Minimum air gap (clearance)

DW-16

through air

Minimum external tracking

Shortest terminal-to-terminal distance

L(I02)(1)

DW-16

(creepage)

across the package surface

Tracking resistance (comparative

CTI

DIN EN 60112 (VDE 0303-11); IEC 60112; UL 746A

600

tracking index)

VIO = 500 V, TA = 25°C

1012

Ω

Isolation resistance, input to

RIO

output(2)

VIO = 500 V, 100°C ≤ TA ≤ max

1011

Ω

Barrier capacitance, input to

CIO

VIO = 0.4 x sin (2πft), f = 1 MHz

output(2)

Input capacitance(3)

VI = VCC/2 + 0.4 x sin (2πft), f = 1 MHz, VCC = 5 V

(1)

Per JEDEC package dimensions.

(2)

All pins on each side of the barrier tied together creating a two-terminal device.

(3)

Measured from input pin to ground.

NOTE

Creepage and clearance requirements should be applied according to the specific

equipment isolation standards of an application. Care should be taken to maintain the

creepage and clearance distance of a board design to ensure that the mounting pads of

the isolator on the printed-circuit board do not reduce this distance.

Creepage and clearance on a printed-circuit board become equal in certain cases.

Techniques such as inserting grooves and/or ribs on a printed circuit board are used to

help increase these specifications.

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