ISO7841F datasheet(19/31 Pages) TI

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Ambient Temperature (GC)

100

150

200

100

200

300

400

500

600

700

D014

VCC1 = VCC2 = 2.75 V

VCC1 = VCC2 = 3.6 V

VCC1 = VCC2 = 5.5 V

Ambient Temperature (GC)

100

150

200

400

600

800

1000

1200

1400

1600

1800

D015

Power

ISO7841, ISO7841F

www.ti.com

SLLSEM3C – NOVEMBER 2014 – REVISED JULY 2015

8.3.1.5 Safety Limiting Values

Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry. A failure of

the I/O can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat

the die and damage the isolation barrier potentially leading to secondary system failures.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

RθJA = 78.9°C/W, VI = 5.5 V, TJ = 150°C, TA = 25°C

288

Safety input, output, or supply

RθJA = 78.9°C/W, VI = 3.6 V, TJ = 150°C, TA = 25°C

440

current for DW-16 Package

RθJA = 78.9°C/W, VI = 2.75 V, TJ = 150°C, TA = 25°C

576

Safety input, output, or total

RθJA = 78.9°C/W, TJ = 150°C, TA = 25°C

1584

power

Maximum case temperature

150

°C

The maximum safety temperature is the maximum junction temperature specified for the device. The power

dissipation and junction-to-air thermal impedance of the device installed in the application hardware determines

the junction temperature. The assumed junction-to-air thermal resistance in the Thermal Information is that of a

device installed on a High-K test board for Leaded Surface Mount Packages. The power is the recommended

maximum input voltage times the current. The junction temperature is then the ambient temperature plus the

power times the junction-to-air thermal resistance

Figure 13.

θJC Thermal Derating Curve per VDE for

Figure 14. Thermal Derating Curve for Safety Limiting

Power per VDE

DW-16 Package

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