DRV421

SBOS704A – MAY 2015 – REVISED JULY 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage (VDD to GND)

–0.3

7

V

Voltage

GND – 0.5

V

GND – 6.0

V

(4)

–300

300

mA

Current

pins AINP and AINN

–5

5

mA

Shunt sense amplifier inputs

All remaining pins

–25

25

mA

–50

150

°C

Temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5 V beyond the supply rails must

be current limited, except for the shunt sense amplifier input pins.

(3)

These inputs are not diode-clamped to the power supply rails.

(4)

Power-limited; observe maximum junction temperature.

6.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic

V

discharge

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage

3.0

5.0

5.5

V

Specified ambient temperature range

–40

125

°C

6.4 Thermal Information

SBOS704

RTJ (QFN)

UNITS

20 PINS

Junction-to-ambient thermal resistance

34.1

°C/W

Junction-to-case (top) thermal resistance

33.1

°C/W

Junction-to-board thermal resistance

11.0

°C/W

Junction-to-top characterization parameter

0.3

°C/W

Junction-to-board characterization parameter

11.0

°C/W

Junction-to-case (bottom) thermal resistance

2.1

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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