MX7575JCWN datasheet(2/12 Pages) MAXIM

2 / 12 page

CMOS, µP-Compatible, 5µs/10µs, 8-Bit ADCs

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ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

(VDD = +5V; VREF = 1.23V; AGND = DGND = 0V; fCLK = 4MHz external for MX7575; fCLK = 2MHz external for MX7576;

TA = TMIN to TMAX, unless otherwise noted.)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

VDD to AGND...............................................................-0.3V, +7V

VDD to DGND ..............................................................-0.3V, +7V

AGND to DGND ...............................................-0.3V, VDD + 0.3V

Digital Input Voltage to DGND

(

CS, RD, TP, MODE) ......................................-0.3V, VDD + 0.3V

Digital Output Voltage to DGND

(

BUSY, D0–D7) ..............................................-0.3V, VDD + 0.3V

CLK Input Voltage to DGND ............................-0.3V, VDD + 0.3V

REF to AGND ...................................................-0.3V, VDD + 0.3V

AIN to AGND....................................................-0.3V, VDD + 0.3V

Continuous Power Dissipation (TA = +70°C)

Plastic DIP (derate 11.11mW/°C above +70°C) ...............889mW

Wide SO (derate 9.52mW/°C above +70°C)..................762mW

CERDIP (derate 10.53mW/°C above +70°C) .................842mW

PLCC (derate 10.00mW/°C above +70°C) ....................800mW

Operating Temperature Ranges

MX757_J/K ............................................................0°C to +70°C

MX757_A/B ........................................................-25°C to +85°C

MX757_JE/KE ....................................................-40°C to +85°C

MX757_S/T.......................................................-55°C to +125°C

Storage Temperature Range .............................-65°C to +160°C

Lead Temperature (soldering,10sec) ..............................+300°C

VIN = 0V or VDD

±10

IIN

Input Current

µA

±1

2.4

VINH

Input High Voltage

0.8

VINL

Input Low Voltage

µA

500

IREF

Reference Current

1.23

VREF

Reference Voltage

SNR

Signal-to-Noise Ratio (Note 2)

V/µs

0.386

Slew Rate, Tracking

Ω

DC Input Impedance

02VREF

Voltage Range

±1

Bits

Resolution

ppm/°C

±5

Offset Tempco

LSB

±1/2

Offset Error (Note 1)

ppm/°C

±5

Full-Scale Tempco

LSB

±1

Full-Scale Error

LSB

±2

TUE

Total Unadjusted Error

±1/2

LSB

±1

INL

Relative Accuracy

Bits

No-Missing-Codes Resolution

UNITS

MIN

TYP

MAX

SYMBOL

PARAMETER

TA = TMIN to TMAX

TA = +25°C

MX757_K/B/T

±5% variation for specified performance

MX7575, VIN = 2.46Vp-p at 10kHz, Figure 13

MX7575

MX757_J/A/S

MX757_K/B/T

MX757_J/A/S

1LSB = 2VREF/256

CONDITIONS

CIN

Input Capacitance (Note 2)

ACCURACY

ANALOG INPUT

REFERENCE INPUT

LOGIC INPUTS

CS, RD, MODE

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