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AM1806 Datasheet(PDF) 238 Page - Texas Instruments |
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AM1806 Datasheet(HTML) 238 Page - Texas Instruments |
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238 / 245 page ![]() AM1806 SPRS658F – FEBRUARY 2010 – REVISED MARCH 2014 www.ti.com 7.5 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 7.6 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms and definitions. 8 Mechanical Packaging and Orderable Information This section describes the device orderable part numbers, packaging options, materials, thermal and mechanical parameters. 8.1 Thermal Data for ZCE Package The following table(s) show the thermal resistance characteristics for the PBGA–ZCE mechanical package. Table 8-1. Thermal Resistance Characteristics (PBGA Package) [ZCE] NO. °C/W(1) AIR FLOW (m/s)(2) 1 R ΘJC Junction-to-case 7.6 N/A 2 R ΘJB Junction-to-board 11.3 N /A 3 R ΘJA Junction-to-free air 23.9 0.00 4 21.2 0.50 5 20.3 1.00 R ΘJMA Junction-to-moving air 6 19.5 2.00 7 18.6 4.00 8 0.2 0.00 9 0.3 0.50 10 PsiJT Junction-to-package top 0.3 1.00 11 0.4 2.00 12 0.5 4.00 13 11.2 0.00 14 11.1 0.50 15 PsiJB Junction-to-board 11.1 1.00 16 11.0 2.00 17 10.9 4.00 (1) These measurements were conducted in a JEDEC defined 2S2P system and will change based on environment as well as application. For more information, see these EIA/JEDEC standards – EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air) and JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages. Power dissipation of 500 mW and ambient temp of 70C assumed. PCB with 2oz (70um) top and bottom copper thickness and 1.5oz (50um) inner copper thickness (2) m/s = meters per second 238 Mechanical Packaging and Orderable Information Copyright © 2010–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: AM1806 |
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