AM4376 datasheet(256/261 Pages) TI

256 / 261 page

AM4376, AM4377, AM4378, AM4379

SPRS851B – JUNE 2014 – REVISED APRIL 2015

www.ti.com

Mechanical Packaging and Orderable Information

7.1

Via Channel

The ZDN package has been specially engineered with Via Channel technology. This technology allows

larger than normal PCB via and trace sizes and reduced PCB signal layers to be used in a PCB design

with the 0.65-mm pitch package, and substantially reduces PCB costs. It allows PCB routing in only two

signal layers (four layers total) due to the increased layer efficiency of the Via Channel BGA technology.

NOTE

Via Channel technology implemented on the this package makes it possible to build a

product with a 4-layer PCB, but a 4-layer PCB may not meet system performance goals.

Therefore, system performance using a 4-layer PCB design must be evaluated during

product design.

7.2

Packaging Information

The following packaging information and addendum reflect the most current data available for the

designated device. This data is subject to change without notice and without revision of this document.

The following figure is a preliminary package drawing for the ZDN package option.

Note: The ZDN package is shown with a 17-mm × 17-mm array of 491 solder balls with 0.65-mm pitch,

with via channel array (VCA) technology.

256

Mechanical Packaging and Orderable Information

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Product Folder Links: AM4376 AM4377 AM4378 AM4379

AM4376 Datasheet(PDF) 256 Page - Texas Instruments