DM385 datasheet(276/281 Pages) TI

276 / 281 page

DM385, DM388

SPRS821D – MARCH 2013 – REVISED DECEMBER 2013

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10 Mechanical

Table 10-1 shows the thermal resistance characteristics for the PBGA–AAR mechanical package.

The device package has been specially engineered with a new technology called Via Channel™, allowing

0.8 mm PCB design rules to be employed. This allows larger than normal PCB via and trace sizes and

reduced PCB signal layers to be used in a PCB design with this 0.5 mm pitch package, and will

substantially reduce PCB costs. It also allows PCB routing in only two signal layers (four layers total

deleted) due to the increased layer efficiency of the Via Channel™ BGA technology.

10.1 Thermal Data for the AAR

Table 10-1. Thermal Resistance Characteristics (PBGA Package) [AAR]

Air Flow (m/s)(1)

ºC/W(2)

still air

17.79

ΘJA/JMA

Junction-to-air/ Junction-to-moving air

1.0 m/s

13.36

2.0 m/s

12.54

3.0 m/s

12.04

still air

0.08

PsiJT

Junction-to-package top

1.0 m/s

0.16

2.0 m/s

0.20

3.0 m/s

0.23

still air

4.90

PsiJB

Junction-to-board

1.0 m/s

4.81

2.0 m/s

4.78

3.0 m/s

4.76

ΘJB

Junction-to-board

4.86

ΘJC (1SOP board)

Junction-to-case

3.84

(1)

m/s = meters per second.

(2)

These measurements were conducted in a JEDEC defined 2S2P system (with the exception of the Theta JC [

ΘJC] measurement, which

was conducted in a JEDEC defined 1S0P system) and will change based on environment as well as application. For more information,

see these EIA/JEDEC standards:

•

JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air).

•

JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages.

•

JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages.

•

JESD51-9, Test Boards for Area Array Surface Mount Packages.

10.2 Packaging Information

The following packaging information and addendum reflect the most current data available for the

designated device(s). This data is subject to change without notice and without revision of this document.

276

Mechanical

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