TPS62360 datasheet(3/56 Pages) TI

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TPS62360, TPS62361B

TPS62362, TPS62363

www.ti.com

SLVSAU9C – MAY 2011 – REVISED NOVEMBER 2012

THERMAL INFORMATION

TPS6236x

THERMAL METRIC(1)

YZH

UNITS

16 PINS

θJA

Junction-to-ambient thermal resistance(2)

94.8

θJCtop

Junction-to-case (top) thermal resistance(3)

θJB

Junction-to-board thermal resistance(4)

°C/W

ψJT

Junction-to-top characterization parameter(5)

3.2

ψJB

Junction-to-board characterization parameter(6)

θJCbot

Junction-to-case (bottom) thermal resistance(7)

n/a

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as

specified in JESD51-7, in an environment described in JESD51-2a.

(3)

The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-

standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

(4)

The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB

temperature, as described in JESD51-8.

(5)

The junction-to-top characterization parameter,

ψJT, estimates the junction temperature of a device in a real system and is extracted

from the simulation data for obtaining

θJA, using a procedure described in JESD51-2a (sections 6 and 7).

(6)

The junction-to-board characterization parameter,

ψJB, estimates the junction temperature of a device in a real system and is extracted

from the simulation data for obtaining

θJA , using a procedure described in JESD51-2a (sections 6 and 7).

(7)

The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific

JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

Spacer

RECOMMENDED OPERATING CONDITIONS

MIN

TYP

MAX

UNIT

VIN

Input voltage range, VIN

IOUT ≤ 2.5A

2.5

5.5

IOUT > 2.5A

5.5

IOUT,avg

Continuous output current(1)

2.5

trf

Rising and falling signal transition time at EN, VSELx

mV/µs

Operating ambient temperature(2)

–40

°C

Operating junction temperature

–40

125

°C

(1)

The TPS6236x device is designed to provide 3A according to typical application processor load profiles. Drawing more than 2.5A

permanently might impact the device life time. See THERMAL AND DEVICE LIFE TIME INFORMATION for details.

(2)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature [TA(max)] is dependent on the maximum operating junction temperature [TJ(max)], the

maximum power dissipation of the device in the application [PD(max)], and the junction-to-ambient thermal resistance of the part/package

in the application (

θJA), as given by the following equation: TA(max) = TJ(max) – (θJA × PD(max))

ELECTRICAL CHARACTERISTICS

Unless otherwise noted the specification applies for VIN = 3.6V over an operating ambient temp. –40°C

≤ TA ≤ 85°C; Circuit

of Parameter Measurement Information section (unless otherwise noted). Typical values are for TA = 25°C.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

INPUT

VIN

Input voltage range at VIN, AVIN

2.5

5.5

VDD

I2C and registers supply voltage range

1.15

3.6

ISD(AVIN)

Shutdown current into AVIN

EN = LOW, VDD = 0V

0.65

µA

TA = 25°C

0.5

µA

EN = LOW,

ISD(VIN)

Shutdown current into VIN

VDD = 0V

TA = 85°C

µA

ISD(VDD)

Shutdown current into VDD

EN = LOW, I2C bus idle

0.01

µA

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