© 2003 High Bandwidth Access, Inc. All rights reserved. Product specifications subject to change without notice.

HDV24VL

October 2003

ADP II

3HD166B

Page 5 of 5

Table 1. Pin Descriptions

Left Port

Right Port

Name

CE

_____

L

CE

_____

R

Chip Enable

R/W

____

L

R/W

____

R

Read/Write Enable

OE

_____

L

OE

_____

R

Output Enable

Address

Data Inputs/ Output

SEM

__________

L

SEM

__________

R

Semaphore Enable

UB

______

L

UB

______

R

Upper Byte Select

LB

_____

L

LB

_____

R

Lower Byte Select

INTF

________

L

INTF

________

R

Interrupt Flag

BUSY

__________

L

BUSY

__________

R

Busy Flag

M/S

___

Master or Slave Select

VCC

Power

GND

Ground

NOTES:

1.

Absolute Max Ratings are for reference only. Permanent damage to the device may occur if

extended period of operation is outside this range. Standard operation should fall within the

Recommended Operating Conditions

.

2.

Table 2. Absolute Maximum Ratings

Symbol

Rating

Com & Ind

Unit

Terminal Voltage with

respect to GND

-0.5 to + 4.6

V

Temperature Under Bias

-55 to +125

Storage Temperature

-65 to +150

DC Output Current

-50 to +50

mA

Symbol

Parameter

Min.

Typ.

Max.

Unit

Recommended Operating Conditions

Supply Voltage

2.6

2.8

3.0

V

GND

Ground Voltage

0

0

0

V

Input High Voltage

2.0

-

Vcc+0.3

V

Input Low Voltage

-0.3

-

0.8

V

Operating Temperature

Industrial

-40

-

85

DC Electrical Characteristics

Input Leakage Current

-

-

10

µA

Output Leakage Current (CE

_____

-

-

10

µA

Output Logic “1” Voltage,

2.0

-

-

V

= 4mA

-

-

0.4

V

Capacitance at 1.0MHz Ambient Temperature (25°C)

Symbol

Parameter

Conditions

Max.

Unit

(2)

Input Capacitance

9

pF

(2)

Output Capacitance

10

pF

NOTES:

1.

2.

Table 3. Operating conditions