SI554 datasheet(14/15 Pages) SILABS

14 / 15 page

Si554

Rev. 1.1

DOCUMENT CHANGE LIST

Revision 0.6 to Revision 1.0

 Updated Table 4 on page 3.



Updated 2.5 V/3.3 V and 1.8 V CML output level

specifications.

 Updated Table 5 on page 4.



Removed the words “Differential Modes:

LVPECL/LVDS/CML” in the footnote referring to AN256.



Added footnotes clarifying max offset frequency test

conditions.



Added CMOS phase jitter specs.

 Updated Table 10 on page 8.



Separated 1.8 V, 2.5 V/3.3 V supply voltage

specifications.



Updated ESD HBM sensitivity rating.

 Updated and clarified Table 8 on page 7



Added “Moisture Sensitivity Level” and “Contact Pads”

rows.

 Updated 6. "Top Marking" on page 13 to reflect

specific marking information (previously, figure was

generic).

 Updated 4. "Package Outline and Suggested Pad

Layout" on page 11.



Added cyrstal impedance pin in Figure 2 on page 11 and

Table 12 on page 11.

 Reordered spec tables and back matter to conform

to data sheet quality conventions.

Revision 1.0 to Revision 1.1

 Added Table 9, “Thermal Characteristics,” on

page 7.

SI554 Datasheet(PDF) 14 Page - Silicon Laboratories