CAP1133 datasheet(7/63 Pages) MICROCHIP

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 2015 Microchip Technology Inc.

DS00001625B-page 7

CAP1133

3.0

ELECTRICAL SPECIFICATIONS

Note 3-1

Stresses above those listed could cause permanent damage to the device. This is a stress rating

only and functional operation of the device at any other condition above those indicated in the

operation sections of this specification is not implied.

Note 3-2

For the 5V tolerant pins that have a pull-up resistor, the voltage difference between V5VT_PIN and VDD

must never exceed 3.6V.

Note 3-3

The Package Power Dissipation specification assumes a recommended thermal via design consisting

of a 2x2 matrix of 0.3mm (12mil) vias at 1.0mm pitch connected to the ground plane with a 1.6 x

2.3mm thermal landing.

TABLE 3-1:

ABSOLUTE MAXIMUM RATINGS

Voltage on 5V tolerant pins (V5VT_PIN)

-0.3 to 5.5

Voltage on 5V tolerant pins (|V5VT_PIN - VDD|) Note 3-2

0 to 3.6

Voltage on VDD pin

-0.3 to 4

Voltage on any other pin to GND

-0.3 to VDD + 0.3

Package Power Dissipation up to TA = 85°C for 10 pin DFN

(see Note 3-3)

0.7

Junction to Ambient (

θJA)

77.7

°C/W

Operating Ambient Temperature Range

-40 to 125

°C

Storage Temperature Range

-55 to 150

°C

ESD Rating, All Pins, HBM

8000

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