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FDC2114RGHT Datasheet(PDF) 57 Page - Texas Instruments |
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FDC2114RGHT Datasheet(HTML) 57 Page - Texas Instruments |
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57 / 60 page ![]() www.ti.com PACKAGE OUTLINE C 16X 0.3 0.2 2.6 0.1 12X 0.5 16X 0.5 0.3 4X 1.5 0.8 MAX A 4.1 3.9 B 4.1 3.9 0.3 0.2 0.5 0.3 (0.1) TYP 4214978/A 10/2013 WQFN - 0.8 mm max height RGH0016A WQFN PIN 1 INDEX AREA SEATING PLANE 1 4 9 12 5 8 16 13 (OPTIONAL) PIN 1 ID DETAIL SEE TERMINAL NOTES: 1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. 0.1 C A B 0.05 C SCALE 3.500 DETAIL OPTIONAL TERMINAL TYPICAL |
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