| Electronic Components Datasheet Search |
|
SPC560D30L3 Datasheet(PDF) 52 Page - STMicroelectronics |
|
|
|||||||||||||||||||||||||||||
SPC560D30L3 Datasheet(HTML) 52 Page - STMicroelectronics |
|
52 / 90 page ![]() Electrical characteristics SPC560D30x, SPC56040Dx 52/90 Doc ID 16315 Rev 7 4.12 Electromagnetic compatibility (EMC) characteristics Susceptibility tests are performed on a sample basis during product characterization. 4.12.1 Designing hardened software to avoid noise problems EMC characterization and optimization are performed at component level with a typical application environment and simplified MCU software. It should be noted that good EMC performance is highly dependent on the user application and the software in particular. Therefore it is recommended that the user apply EMC software optimization and prequalification tests in relation with the EMC level requested for his application. ● Software recommendations The software flowchart must include the management of runaway conditions such as: – Corrupted program counter – Unexpected reset – Critical data corruption (control registers...) ● Prequalification trials Most of the common failures (unexpected reset and program counter corruption) can be reproduced by manually forcing a low state on the reset pin or the oscillator pins for 1 second. To complete these trials, ESD stress can be applied directly on the device. When unexpected behavior is detected, the software can be hardened to prevent unrecoverable errors occurring (see the application note Software Techniques For Improving Microcontroller EMC Performance (AN1015)). 4.12.2 Electromagnetic interference (EMI) The product is monitored in terms of emission based on a typical application. This emission test conforms to the IEC 61967-1 standard, which specifies the general conditions for EMI measurements. tFLALPEXIT C C T Delay for flash module to exit low-power mode(2) Code flash — — 0.5 µs tFLAPDEXIT C C T Delay for flash module to exit power-down mode Code flash — — 30 µs Data flash — — 30(3) µs tFLALPENTRY C C T Delay for flash module to enter low-power mode Code flash — — 0.5 µs tFLAPDENTRY C C T Delay for flash module to enter power- down mode Code flash — — 1.5 µs Data flash — — 4(3) µs 1. VDD = 3.3 V ± 10% / 5.0 V ± 10%, TA = 40 to 125 °C, unless otherwise specified 2. Data flash does not support low-power mode 3. If code flash is already switched-on. Table 32. Start-up time/Switch-off time (continued) Symbol C Parameter Conditions(1) Value Unit Min Typ Max |
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |