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SPC560D30L3 Datasheet(PDF) 14 Page - STMicroelectronics

Part # SPC560D30L3
Description  32-bit MCU family built on the Power Architecture for automotive body electronics applications
PDF  90 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

SPC560D30L3 Datasheet(HTML) 14 Page - STMicroelectronics

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Package pinouts and signal descriptions
SPC560D30x, SPC56040Dx
14/90
Doc ID 16315 Rev 7
Figure 3 shows the Pictus 512K in the LQFP64 package.
Figure 3.
LQFP64 pin configuration (top view)
3.2
Pad configuration during reset phases
All pads have a fixed configuration under reset.
During the power-up phase, all pads are forced to tristate.
After power-up phase, all pads are forced to tristate with the following exceptions:
PA[9] (FAB) is pull-down. Without external strong pull-up the device starts fetching from
flash.
PA[8] (ABS[0]) is pull-up.
RESET pad is driven low. This is pull-up only after PHASE2 reset completion.
JTAG pads (TCK, TMS and TDI) are pull-up while TDO remains tristate.
Precise ADC pads (PB[7:4] and PD[11:0]) are left tristate (no output buffer available).
Main oscillator pads (EXTAL, XTAL) are tristate.
3.3
Voltage supply pins
Voltage supply pins are used to provide power to the device. Two dedicated pins are used
for 1.2 V regulator stabilization.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
PB[3]
PC[9]
PA[2]
PA[1]
PA[0]
VSS_HV
VDD_HV
VSS_HV
RESET
VSS_LV
VDD_LV
VDD_BV
PC[10]
PB[0]
PB[1]
PC[6]
PA[11]
PA[10]
PA[9]
PA[8]
PA[7]
PA[3]
PB[15]
PB[14]
PB[13]
PB[12]
PB[11]
PB[7]
PB[6]
PB[5]
VDD_HV_ADC
VSS_HV_ADC
LQFP64



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