SPC560D30L3 datasheet(38/90 Pages) STMICROELECTRONICS

38 / 90 page

Electrical characteristics

SPC560D30x, SPC56040Dx

38/90

Doc ID 16315 Rev 7

4.7.4

Output pin transition times

4.7.5

I/O pad current specification

The I/O pads are distributed across the I/O supply segment. Each I/O supply segment is

associated to a VDD/VSS supply pair as described in Table 20.

Table 21 provides I/O consumption figures.

In order to ensure device reliability, the average current of the I/O on a single segment

should remain below the IAVGSEG maximum value.

Table 19.

Output pin transition times

Symbol C

Parameter

Conditions(1)

Value

Unit

Min Typ Max

ttr CC

Output transition time output

pin(2)

SLOW configuration

CL = 25 pF

VDD = 5.0 V ± 10%, PAD3V5V = 0

——

TCL = 50 pF

—

100

DCL = 100 pF

—

125

DCL = 25 pF

VDD = 3.3 V ± 10%, PAD3V5V = 1

——

TCL = 50 pF

—

100

DCL = 100 pF

—

125

ttr CC

Output transition time output

pin(2)

MEDIUM configuration

CL = 25 pF

VDD = 5.0 V ± 10%, PAD3V5V = 0

SIUL.PCRx.SRC = 1

——

TCL = 50 pF

—

DCL = 100 pF

—

DCL = 25 pF

VDD = 3.3 V ± 10%, PAD3V5V = 1

SIUL.PCRx.SRC = 1

——

TCL = 50 pF

—

DCL = 100 pF

—

VDD = 3.3 V ± 10% / 5.0 V ± 10%, TA = 40 to 125 °C, unless otherwise specified

CL includes device and package capacitances (CPKG < 5 pF).

Table 20.

I/O supply segment

Package

Supply segment

123

LQFP100

pin 16 – pin 35

pin 37 – pin 69

pin 70 – pin 83

pin 84 – pin 15

LQFP64

pin 8 – pin 26

pin 28 – pin 55

pin 56 – pin 7

—

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