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TLE6240GP Datasheet(PDF) 4 Page - Infineon Technologies AG

Part # TLE6240GP
Description  Smart 16-fold Low-Side Switch
PDF  23 Pages
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Manufacturer  INFINEON [Infineon Technologies AG]
Direct Link  http://www.infineon.com
Logo INFINEON - Infineon Technologies AG

TLE6240GP Datasheet(HTML) 4 Page - Infineon Technologies AG

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Data Sheet TLE 6240 GP
V3.1
Page
26.Aug 2002
4
Maximum Ratings for Tj = – 40°C to 150°C
Parameter
Symbol
Values
Unit
Supply Voltage
VS
-0.3 ... +7
V
Continuous Drain Source Voltage (OUT1...OUT16)
VDS
45
V
Input Voltage, All Inputs and Data Lines
VIN
- 0.3 ... + 7
V
Load Dump Protection VLoad Dump = UP+US; UP=13.5 V
RI
1
)=2 Ω; td=400ms; IN = low or high
Channel 1-8 with Automotive Relay RL = 65
Ω
Channel 9-16 with Automotive Injector Valve RL = 14
Ω
RI=2 Ω; td=400ms; IN = low or high
Channel 1-8 with Load RL = 24
Ω
Channel 9-16 with Load RL = 6.8
Ω
VLoad Dump
2
)
90
65
65
50
V
Output Current per Channel (see el. characteristics)
ID(lim)
ID(lim) min
A
Output Current per Channel @ TA = 25°C
(All 16 Channels ON; Mounted on PCB )
3
)
ID1-8
ID9-16
0.3
0.5
A
Output Current
(Max. total current of all channels on; Heat Sink required)
IDmax
14
A
Single Pulse Inductive Energy (internal clamping)
TJ = 25°C, ID1-8 = 0.5 A, ID9-16 = 1 A
EAS
50
mJ
Power Dissipation (DC, mounted on PCB) @ TA = 25°C
Ptot
3.3
W
Electrostatic Discharge Voltage (Human Body Model)
according to MIL STD 883D, method 3015.7 and EOS/ESD
assn. standard S5.1 - 1993
VESD
2000
V
DIN Humidity Category, DIN 40 040
E
IEC Climatic Category, DIN IEC 68-1
40/150/56
Thermal Resistance
junction - case (die soldered on heat slug)
junction - ambient @ min. footprint
junction - ambient @ 6 cm
2 cooling area with heat pipes
RthJC
RthJA
1.5
50
38
K/W
1
) R
I=internal resistance of the load dump test pulse generator LD200
2
) V
LoadDump is setup without DUT connected to the generator per ISO 7637-1 and DIN 40 839.
3
) Output current rating so long as maximum junction temperature is not exceeded. At T
A = 125 °C the output cur-
rent has to be calculated using RthJA according mounting conditions.
PCB with heat pipes,
back side 6 cm
2 cooling area
Minimum footprint



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