ADC08351 datasheet(5/15 Pages) NSC

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Converter Electrical Characteristics (Continued)

The following specifications apply for V

A =VD = +3.0 VDC,VREF = 2.4V, VIN = 1.63 VP-P, OE = 0V, CL = 20 pF,

CLK = 42 MHz, 50% duty cycle, unless otherwise specified.

Boldface limits apply for T

A =TMIN to TMAX: all other limits TA = 25˚C (Notes 7, 8)

Symbol

Parameter

Conditions

Typical

(Note 9)

Limits

(Note 9)

Units

(Limits)

Digital Output Characteristics

High Level Output Current

D = 2.7V, VOH =VD −0.5V

−1.1

mA (min)

Low Level Output Current

D = 2.7V, OE = DGND, VOL = 0.4V

1.8

mA (min)

High Level Output Voltage

D = 2.7V, IOH = −360 µA

2.65

Low Level Output Voltage

D = 2.7V, IOL = 1.6 mA

0.2

OZH,

OZL

TRI-STATE Output Current

OE = V

D = 3.3V, VOH = 3.3V or VOL =0V

±10

µA

AC Electrical Characteristics

Maximum Conversion Rate

MHz (min)

Minimum Conversion Rate

MHz

Output Delay

CLK High to Data Valid

ns (max)

Pipline Delay (Latency)

2.5

Clock

Cycles

Sampling (Aperture) Delay

CLK Low to Acquisition of Data

Output Hold Time

CLK High to Data Invalid

OE Low to Data Valid

Loaded as in

Figure 2

DIS

OE High to High Z State

Loaded as in

Figure 2

ENOB

Effective Number of Bits

CLK = 30 MHz, fIN = 1 MHz

7.2

Bits

CLK = 42 MHz, fIN = 4.4 MHz

7.2

Bits

CLK = 42 MHz, fIN = 21 MHz

6.8

6.1

Bits (min)

SINAD

Signal-to-Noise & Distortion

CLK = 30 MHz, fIN = 1 MHz

CLK = 42 MHz, fIN = 4.4 MHz

CLK = 42 MHz, fIN = 21 MHz

38.5

dB (min)

SNR

Signal-to-Noise Ratio

CLK = 30 MHz, fIN = 1 MHz

CLK = 42 MHz, fIN = 4.4 MHz

CLK = 42 MHz, fIN = 21 MHz

dB (min)

THD

Total Harmonic Distortion

CLK = 30 MHz, fIN = 1 MHz

−57

CLK = 42 MHz, fIN = 4.4 MHz

−51

CLK = 42 MHz, fIN = 21 MHz

−46

−41

dB (min)

SFDR

Spurious Free Dynamic Range

CLK = 30 MHz, fIN = 1 MHz

CLK = 42 MHz, fIN = 4.4 MHz

CLK = 42 MHz, fIN = 21 MHz

dB (min)

Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is func-

tional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed speci-

fications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions.

Note 2: All voltages are measured with respect to GND = AGND = DGND = 0V, unless otherwise specified.

Note 3: When the input voltage at any pin exceeds the power supplies (that is, less than AGND or DGND, or greater than VA or VD), the current at that pin should

be limited to 25 mA. The 50 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of

25 mA to two.

Note 4: The absolute maximum junction temperature (TJmax) for this device is 150˚C. The maximum allowable power dissipation is dictated by TJmax, the

junction-to-ambient thermal resistance (

θJA), and the ambient temperature (TA), and can be calculated using the formula PDMAX=(TJmax - TA)/θJA. For the 20-pin

TSSOP,

θJA is 135˚C/W, so PDMAX = 926 mW at 25˚C and 481 mW at the maximum operating ambient temperature of 85˚C. Note that the power dissipation of this

device under normal operation will typically be about 68 mW (40 mW quiescent power + 23 mW reference ladder power+5mWdue to 1 TTL loan on each digital

output). The values for maximum power dissipation listed above will be reached only when the ADC08351 is operated in a severe fault condition (e.g., when input

or output pins are driven beyond the power supply voltages, or the power supply polarity is reversed). Obviously, such conditions should always be avoided.

Note 5: Human body model is 100 pF capacitor discharged through a 1.5 k

Ω resistor. Machine model is 220 pF discharged through ZERO Ohms.

Note 6: See AN-450, “Surface Mounting Methods and Their Effect on Product Reliability”, or the section entitled “Surface Mount” found in any post 1986 National

Semiconductor Linear Data Book, for other methods of soldering surface mount devices.

Note 7: All inputs are protected as shown below. Input voltage magnitudes up to 500 mV above the supply voltage or 500 mV below GND will not damage this device.

However, errors in the A/D conversion can occur if the input goes above VA or below AGND by more than 300 mV. As an example, if VA is 3.0 VDC, the full-scale

input voltage must be

≤3.3 VDC to ensure accurate conversions.

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