REV. 0

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a

ADG819/ADG820

One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.

Tel: 781/329-4700

www.analog.com

Fax: 781/326-8703

© Analog Devices, Inc., 2002

0.5

CMOS

1.8 V to 5.5 V 2:1 Mux/SPDT Switches

FUNCTIONAL BLOCK DIAGRAM

ADG819/

ADG820

IN

S1

S2

D

SWITCHES SHOWN

FOR A LOGIC “1” INPUT

FEATURES

Low On Resistance 0.8

Max at 125 C

0.25

Max On Resistance Flatness

1.8 V to 5.5 V Single Supply

200 mA Current Carrying Capability

Automotive Temperature Range: –40 C to +125 C

Rail-to-Rail Operation

6-Lead SOT-23 Package, 8-Lead

SOIC Package, and

6-Bump MicroCSP (Micro Chip Scale Package) ADG819

Fast Switching Times

Typical Power Consumption (<0.01

W)

TTL-/CMOS-Compatible Inputs

Pin Compatible with the ADG719 (ADG819)

APPLICATIONS

Power Routing

Battery-Powered Systems

Communication Systems

Data Acquisition Systems

Cellular Phones

Modems

PCMCIA Cards

Hard Drives

Relay Replacement

GENERAL DESCRIPTION

The ADG819 and the ADG820 are monolithic, CMOS, SPDT

(single-pole, double-throw) switches. These switches are designed

on a submicron process that provides low power dissipation yet

gives high switching speed, low On resistance, and low leakage

currents.

Low power consumption and an operating supply range of 1.8 V

to 5.5 V make the ADG819 and ADG820 ideal for battery-pow-

ered, portable instruments.

Each switch of the ADG819 and the ADG820 conducts equally

well in both directions when on. The ADG819 exhibits break-

before-make switching action, thus preventing momentary shorting

when switching channels. The ADG820 exhibits make-before-

break action.

The ADG819 and the ADG820 are available in a 6-lead SOT-23

package and an 8-lead

µSOIC package. The ADG819 is also

available in a 2

× 3 bump 1.14 mm × 2.18 mm MicroCSP

package. This chip occupies only a 1.14 mm

× 2.18 mm area,

making it the ideal candidate for space-constrained applications.

PRODUCT HIGHLIGHTS

1. Very low ON resistance, 0.5

Ω typical

2. 1.8 V to 5.5 V single-supply operation

3. High current carrying capability

4. Tiny 6-lead SOT-23 package, 8-lead

µSOIC package,

and 2

× 3 bump 1.14 mm × 2.18 mm MicroCSP package

(ADG819 only)