ADG820 datasheet(4/12 Pages) AD

4 / 12 page

REV. 0

ADG819/ADG820

–4–

ABSOLUTE MAXIMUM RATINGS

(TA = 25

°C, unless otherwise noted.)

VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V

Analog Inputs

2 . . . . . . . . . . . . . . . . . –0.3 V to V

DD + 0.3 V or

. . . . . . . . . . . . . . . . . . . . . . . 30 mA, Whichever Occurs First

Digital Inputs

2 . . . . . . . . . . . . . . . . . –0.3 V to V

DD + 0.3 V or

. . . . . . . . . . . . . . . . . . . . . . . 30 mA, Whichever Occurs First

Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . 400 mA

. . . . . . . . . . . . . . . .(Pulsed at 1 ms, 10% Duty Cycle Max)

Continuous Current, S or D . . . . . . . . . . . . . . . . . . . 200 mA

Operating Temperature Range

Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . . –40

°C to +85°C

Automotive . . . . . . . . . . . . . . . . . . . . . . . . –40

°C to +125°C

Storage Temperature Range . . . . . . . . . . . . –65

°C to +150°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . 150

°C

µSOIC Package

JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . .

206

°C/W

JC Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 44

°C/W

SOT-23 Package (4-Layer Board)

JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . .

119

°C/W

MicroCSP Package

JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . . .

TBD

Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . 300

°C

IR Reflow, Peak Temperature (<20 sec) . . . . . . . . . . . 235

°C

NOTES

1 Stresses above those listed under Absolute Maximum Ratings may cause perma-

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those listed in the operational

sections of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability. Only one absolute

maximum rating may be applied at any one time.

2 Overvoltages at IN, S, or D will be clamped by internal diodes. Current should be

limited to the maximum ratings given.

Table I. Truth Table for the ADG819/ADG820

Switch S1

Switch S2

OFF

PIN CONFIGURATIONS

6-Lead SOT-23

(RT-6)

TOP VIEW

(Not to Scale)

ADG819/

ADG820

VDD

GND

8-Lead

µSOIC

(RM-8)

TOP VIEW

(Not to Scale)

NC = NO CONNECT

ADG819/

ADG820

VDD

GND

3 MicroCSP

VDD

GND

ADG819 ONLY

TOP VIEW

(BUMPS AT THE BOTTOM)

NOT TO SCALE

ORDERING GUIDE

Model Option

Temperature Range

Brand

Package Description

Package

ADG819BRM

–40

°C to +125°C

SNB

µSOIC (MicroSmall Outline IC)

RM-8

ADG819BRT

–40

°C to +125°C

SNB

SOT-23 (Plastic Surface-Mount)

RT-6

ADG819BCB

–40

°C to +85°C

SNB

MicroCSP (Micro Chip Scale Package)

CB-62

ADG820BRM

–40

°C to +125°C

SPB

µSOIC (MicroSmall Outline IC)

RM-8

ADG820BRT

–40

°C to +125°C

SPB

SOT-23 (Plastic Surface-Mount)

RT-6

NOTES

1Branding on these packages is limited to three characters due to space constraints.

2Contact factory for availability.

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