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BCM4354 Datasheet(PDF) 185 Page - Cypress Semiconductor |
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BCM4354 Datasheet(HTML) 185 Page - Cypress Semiconductor |
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185 / 192 page ![]() Package Information BCM4354 Data Sheet BROADCOM CONFIDENTIAL Broadcom® October 15, 2014 • 4354-DS109-R Page 184 Section 22: Package Information Package Thermal Characteristics The information in Table 62 and Table 63 is based on the following conditions: • No heat sink, TA = 70°C. This is an estimate, based on a 4-layer PCB that conforms to EIA/JESD51–7 (101.6 mm × 101.6 mm × 1.6 mm) and P = 1.53W continuous dissipation. • Absolute junction temperature limits are maintained through active thermal monitoring and driver-based techniques that may include duty-cycle limiting or turning off one of the TX chains, or both. Table 62: WLCSP Package Thermal Characteristics Characteristic WLCSP θJA (°C/W) (value in still air) 26.86 θJB (°C/W) 2.23 θJC (°C/W) 1.09 JT (°C/W) 2.48 JB (°C/W) 11.61 Maximum Junction Temperature Tj (°C) 125 Maximum Power Dissipation (W) 1.53 Table 63: WLBGA Package Thermal Characteristics Characteristic WLBGA θJA (°C/W) (value in still air) 26.80 θJB (°C/W) 1.66 θJC (°C/W) 1.16 JT (°C/W) 1.85 JB (°C/W) 7.93 Maximum Junction Temperature Tj (°C) 125 Maximum Power Dissipation (W) 1.53 |
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