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AD5641 Datasheet(PDF) 16 Page - Analog Devices

Part # AD5641
Description  2.7 V to 5.5 V, <100 uA, 14-Bit nanoDAC D/A in SC70 Package
PDF  20 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

AD5641 Datasheet(HTML) 16 Page - Analog Devices

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AD5641
Preliminary Technical Data
Rev. PrC | Page 16 of 20
USING AD5641 WITH AN OPTO-ISOLATED
INTERFACE
In process-control applications in industrial environments, it is
often necessary to use an opto-isolated interface to protect and
isolate the controlling circuitry from any hazardous common-
mode voltages that might occur in the area where the DAC is
functioning. Opto-isolators provide isolation in excess of 3 kV.
Because the AD5641 uses a 3-wire serial logic interface, it
requires only three opto-isolators to provide the required
isolation (see Figure 36). The power supply to the part also
needs to be isolated. This is done by using a transformer. On the
DAC side of the transformer, a 5 V regulator provides the 5 V
supply required for the AD5641.
V
DD
0.1
µF
V
DD
V
DD
10k
Ω
10k
Ω
10k
Ω
+5V
REGULATOR
VOUT
GND
DIN
SYNC
SCLK
POWER
10
µF
V
DD
SYNC
SCLK
DATA
AD5641
Figure 36. AD5641 with an Opto-Isolated Interface
POWER SUPPLY BYPASSING AND GROUNDING
When accuracy is important in a circuit, it is helpful to carefully
consider the power supply and ground return layout on the
board. The printed circuit board containing the AD5641 should
have separate analog and digital sections, each having its own
area of the board. If the AD5641 is in a system where other
devices require an AGND to DGND connection, the connection
should be made at one point only. This ground point should be
as close to the AD5641 as possible.
The power supply to the AD5641 should be bypassed with
10 µF and 0.1 µF capacitors. The capacitors should be physically
as close as possible to the device, with the 0.1 µF capacitor
ideally right up against the device. The 10 µF capacitors are the
tantalum bead type. It is important that the 0.1 µF capacitor
have low effective series resistance (ESR) and effective series
inductance (ESI), such as in common ceramic types of capaci-
tors. This 0.1 µF capacitor provides a low impedance path to
ground for high frequencies caused by transient currents due to
internal logic switching.
The power supply line itself should have as large a trace as
possible to provide a low impedance path and reduce glitch
effects on the supply line. Clocks and other fast switching digital
signals should be shielded from other parts of the board by
digital ground. Avoid crossover of digital and analog signals, if
possible. When traces cross on opposite sides of the board,
ensure that they run at right angles to each other to reduce
feedthrough effects through the board. The best board layout
technique is the microstrip technique where the component
side of the board is dedicated to the ground plane only and the
signal traces are placed on the solder side. However, this is not
always possible with a 2-layer board.



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