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AD5660 Datasheet(PDF) 18 Page - Analog Devices

Part # AD5660
Description  3 V/5 V, 16-Bit nanoDACTM D/A with 10 ppm/째C Max On-Chip Reference in SOT-23
PDF  20 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

AD5660 Datasheet(HTML) 18 Page - Analog Devices

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AD5660
Preliminary Technical Data
Rev. PrJ Page 18 of 20
POWER SUPPLY BYPASSING AND GROUNDING
When accuracy is important in a circuit it is helpful to carefully
consider the power supply and ground return layout on the
board. The printed circuit board containing the AD5660 should
have separate analog and digital sections, each having its own
area of the board. If the AD5660 is in a system where other
devices require an AGND to DGND connection, the connection
should be made at one point only. This ground point should be
as close as possible to the AD5660.
The power supply to the AD5660 should be bypassed with
10 µF and 0.1 µF capacitors. The capacitors should be physically
as close as possible to the device with the 0.1 µF capacitor
ideally right up against the device. The 10 µF capacitors are the
tantalum bead type. It is important that the 0.1 µF capacitor has
low effective series resistance (ESR) and effective series
inductance (ESI), for example, common ceramic types of
capacitors. This 0.1 µF capacitor provides a low impedance path
to ground for high frequencies caused by transient currents due
to internal logic switching.
The power supply line itself should have as large a trace as
possible to provide a low impedance path and reduce glitch
effects on the supply line. Clocks and other fast switching digital
signals should be shielded from other parts of the board by
digital ground. Avoid crossover of digital and analog signals if
possible. When traces cross on opposite sides of the board,
ensure that they run at right angles to each other to reduce
feedthrough effects through the board. The best board layout
technique is the microstrip technique where the component
side of the board is dedicated to the ground plane only and the
signal traces are placed on the solder side. However, this is not
always possible with a 2-layer board.



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