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FDC2114 Datasheet(PDF) 59 Page - Texas Instruments |
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FDC2114 Datasheet(HTML) 59 Page - Texas Instruments |
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59 / 61 page  www.ti.com EXAMPLE BOARD LAYOUT ( 2.6) 0.07 MIN ALL AROUND 0.07 MAX ALL AROUND 16X (0.6) 16X (0.25) (3.8) (3.8) 5X ( ) VIA 0.2 12X (0.5) (0.25) TYP (1) (1) 4214978/A 10/2013 WQFN - 0.8 mm max height RGH0016A WQFN SYMM SEE DETAILS 1 4 5 8 9 12 13 16 SYMM LAND PATTERN EXAMPLE SCALE:15X NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see QFN/SON PCB application report in literature No. SLUA271 (www.ti.com/lit/slua271). SOLDER MASK OPENING METAL SOLDER MASK DEFINED METAL SOLDER MASK OPENING SOLDER MASK DETAILS NON SOLDER MASK DEFINED (PREFERRED) |
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