LM9070 datasheet(2/19 Pages) TI1

2 / 19 page

LM9070

SNVS130E – DECEMBER 1999 – REVISED APRIL 2013

www.ti.com

Tab is internally connected to ground.

Figure 3. 7-Lead TO-220 Package

Figure 4. 7-Lead TO-220 Package

(Odd numbered pins bent forward away from

(Even numbered pins bent forward away from

package body)

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1)

Input Voltage, DC

−26V to +40V

ON/OFF, Keep-Alive Inputs

(through 1k

Ω)

−26V to +26V

Positive Input Transient (t<100 ms)

60V

Negative Input Transient (t<1 ms)

−50V

Reset Output Sink Current

5 mA

Power Dissipation

Internally Limited

Junction Temperature

150°C

ESD Susceptibility (2)

12 kV, 2 kV

Lead Temperature

(Soldering, 10 seconds)

260°C

Storage Temperature

−50°C to +150°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and conditions,

see the Electrical Characteristics.

(2)

All pins will survive an ESD impulse of ±2000V using the human body model of 100 pF discharged through a 1.5 k

Ω resistor. In addition,

input pins VIN and the ON/OFF input will withstand ten pulses of ±12 kV from a 150 pF capacitor discharged through a 560Ω resistor

with each pin bypassed with a 22 nF, 100V capacitor.

Operating Ratings

(1)

Input Voltage

6V to 26V

Ambient Temperature

−40°C to +125°C

TO-220 Thermal Resistance,

θJ-C

3°C/W

TO-220 Thermal Resistance,

θJ-A

(2)

73°C/W

TO-263 Thermal Resistance,

θJ-C

3°C/W

TO-263 Thermal Resistance,

θJ-A

(3)

80°C/W

SO20 Thermal Resistance,

θJ-PINS

25°C/W

SO20 Thermal Resistance,

θJ-A

85°C/W

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and conditions,

see the Electrical Characteristics.

(2)

Exceeding the Maximum Allowable power dissipation will cause excessive die temperature, and the device will go into thermal

shutdown. The

θJ-A value for the TO-220 package (still air, no additional heat sink) is 73°C/W. The effective θJ-A value of the TO-220

package can be reduced by using conventional heat sink methods.

(3)

Exceeding the Maximum Allowable power dissipation will cause excessive die temperature, and the device will go into thermal

shutdown. The

θJ-A value for the TO-263 package (still air, no additional heat sink) is 80°C/W. The effective θJ-A value of the TO-263

package can be reduced by increasing the printed circuit board area that is connected (soldered) to the package tab. Using 1 ounce (1.4

mils thick) copper clad with no solder mask, an area of 0.5 square inches will reduce

θJ-A to 50°C/W, an area of 1.0 square inches will

reduce

θJ-Ato 37°C/W, ad an area of 1.6 square inches will reduce θJ-A to 32°C/W. If the printed circuit board uses a solder mask, the

copper clad area should be increased by at least 50% to maintain a similar

θJ-A rating.

Submit Documentation Feedback

Product Folder Links: LM9070

LM9070 Datasheet(PDF) 2 Page - Texas Instruments

LM9070 Datasheet(HTML) 2 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19

Datasheet Download

Link URL