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OPA660AP Datasheet(PDF) 3 Page - Texas Instruments

Part # OPA660AP
Description  OPERATIONAL TRANSCONDUCTANCE AMPLIFIER AND BUFFER
PDF  20 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

OPA660AP Datasheet(HTML) 3 Page - Texas Instruments

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OPA660
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes
no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change
without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant
any BURR-BROWN product for use in life support devices and/or systems.
ABSOLUTE MAXIMUM RATINGS
Power Supply Voltage .........................................................................
±6V
Input Voltage(1) ........................................................................
±V
S ±0.7V
Operating Temperature ................................................... –40
°C to +85°C
Storage Temperature ..................................................... –40
°C to +125°C
Junction Temperature .................................................................... +175
°C
Lead Temperature (soldering, 10s) ............................................... +300
°C
NOTE: (1) Inputs are internally diode-clamped to
±V
S.
Top View
DIP/SO-8
I
Adjust
E
B
V– = –5V
C
V+ = +5V
Out
In
1
2
3
4
8
7
6
5
Q
1
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
PIN CONFIGURATION
PACKAGE
DRAWING
TEMPERATURE
PRODUCT
PACKAGE
NUMBER(1)
RANGE
OPA660AP
8-Pin Plastic DIP
006
–25
°C to +85°C
OPA660AU
SO-8 Surface-Mount
182
–25
°C to +85°C
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix C of Burr-Brown IC Data Book.
PACKAGE/ORDERING INFORMATION



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