Rev: 1.12 7/2002

27/31

© 1999, Giga Semiconductor, Inc.

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com

Preliminary

GS84018/32/36AT/B-180/166/150/100

TQFP Package Drawing

E1

E

b

e

c

L

L1

A2

A1

θ

Notes:

1. All dimensions are in millimeters (mm).

2. Package width and length do not include mold protrusion.

Symbol

Description

Min. Nom. Max

A1

Standoff

0.05

0.10

0.15

A2

Body Thickness

1.35

1.40

1.45

b

Lead Width

0.20

0.30

0.40

c

Lead Thickness

0.09

0.20

D

Terminal Dimension

21.9

22.0

22.1

D1

Package Body

19.9

20.0

20.1

E

Terminal Dimension

15.9

16.0

16.1

E1

Package Body

13.9

14.0

14.1

e

Lead Pitch

0.65

L

Foot Length

0.45

0.60

0.75

L1

Lead Length

1.00

Y

Coplanarity

0.10

θ

Lead Angle

0

°

7

°