Rev: 1.12 7/2002

16/31

© 1999, Giga Semiconductor, Inc.

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com

Preliminary

GS84018/32/36AT/B-180/166/150/100

Note: This parameter is sample tested.

Notes:

1. Junction temperature is a function of SRAM power dissipation, package thermal resistance, mounting board temperature, ambient. Temper-

ature air flow, board density, and PCB thermal resistance.

2. SCMI G-38-87.

3. Average thermal resistance between die and top surface, MIL SPEC-883, Method 1012.1.

4.

For x18 configuration, consult factory.

Capacitance

Parameter

Symbol

Test conditions

Typ.

Max.

Unit

Control Input Capacitance

34

pF

Input Capacitance

45

pF

Output Capacitance

67

pF

Package Thermal Characteristics

Rating

Layer Board

Symbol

TQFP Max

BGA Max

Unit

Notes

Junction to Ambient (at 200 lfm)

single

40

38

°C/W

1,2,4

Junction to Ambient (at 200 lfm)

four

24

21

°C/W

1,2,4

Junction to Case (TOP)

95

°C/W

3,4

20% tKC

50%

Undershoot Measurement and Timing

Overshoot Measurement and Timing

20% tKC

50%