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AD7873ACP Datasheet(PDF) 24 Page - Analog Devices |
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AD7873ACP Datasheet(HTML) 24 Page - Analog Devices |
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24 / 28 page ![]() AD7873 Rev. D | Page 24 of 28 OUTLINE DIMENSIONS 16 9 8 1 PIN 1 SEATING PLANE 0.010 0.004 0.012 0.008 0.025 BSC 0.010 0.006 0.050 0.016 8° 0° COPLANARITY 0.004 0.065 0.049 0.069 0.053 0.154 BSC 0.236 BSC COMPLIANT TO JEDEC STANDARDS MO-137AB 0.193 BSC Figure 40. 16-Lead Shrink Small Outline Package [QSOP] (RQ-16) Dimensions shown in inches 16 9 8 1 PIN 1 SEATING PLANE 8° 0° 4.50 4.40 4.30 6.40 BSC 5.10 5.00 4.90 0.65 BSC 0.15 0.05 1.20 MAX 0.20 0.09 0.75 0.60 0.45 0.30 0.19 COPLANARITY 0.10 COMPLIANT TO JEDEC STANDARDS MO-153AB Figure 41. 16-Lead Thin Shrink Small Outline Package [TSSOP] (RU-16) Dimensions shown in millimeters 16 5 13 8 9 12 1 4 BOTTOM VIEW 2.25 2.10 SQ 1.95 0.75 0.60 0.50 0.65 BSC 1.95 BSC 0.35 0.28 0.25 12° MAX 0.20 REF SEATING PLANE PIN 1 INDICATOR TOP VIEW 4.0 BSC SQ 3.75 BSC SQ 0.60 MAX 0.60 MAX 0.05 MAX 0.02 NOM 0.80 MAX 0.65 TYP PIN 1 INDICATOR 1.00 0.85 0.80 COPLANARITY 0.08 0.25 MIN COMPLIANT TO JEDEC STANDARDS MO-220-VGGC Figure 42. 16-Lead Lead Frame Chip Scale Package [LFCSP] (CP-16) Dimensions shown in millimeters |
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