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138

CWR06

Vishay Sprague

Document Number 40009

Revision 16-Nov-04

For technical questions, contact tantalum@vishay.com

Case Code

Maximum Permissible

Power Dissipation

@ + 25

A

B

C

D

E

F

G

H

0.060

0.075

0.075

0.085

0.095

0.110

0.120

0.150

in inches [millimetres]

REFLOW SOLDER PADS*

6.

Printed Circuit Board Materials: The CWR06 is

compatible with commonly used printed circuit board

materials (alumina substrates, FR4, FR5, G10, PTFE-

fluorocarbon and porcelainized steel). If you desire

other board materials, contact the factory for

availability.

7.

Attachment:

7.1

Solder Paste: The recommended thickness of the

solder paste after application is .007" ± .001"

[.178mm ± .025mm]. Care should be exercised in

selecting the solder paste. The metal purity should

be as high as practical. The flux (in the paste) must

be active enough to remove the oxides formed on the

metallization prior to the exposure to soldering heat. In

practice this can be aided by extending the solder

preheat time at temperatures below the liquidous state

of the solder.

7.2

Soldering: Capacitors can be attached by

conventional soldering techniques - vapor phase,

infrared reflow, wave soldering and hot plate methods.

The Soldering Profile chart shows maximum

recomended time/temperature conditions for solder-

ing. Attachment with a soldering iron is not recom-

mended due to the difficulty of controlling temperature

and time at temperature.

8.

Cleaning (Flux Removal) After Soldering: The

CWR06 is compatible with all commonly used solvents

such as TES, TMS, Prelete, Chlorethane, Terpene

and aqueous cleaning media. However, CFC/ODS

products are not used in the production of these

devices and are not recommended. Solvents

containing methylene chloride or other epoxy solvents

should be avoided since these attack the epoxy

encapsulation material.

9

Recommended Mounting Pad Geometries: The

area under the tantalum wire nib should not be

metallized on the PC board. The width dimension

indicated is the same as the maximum width of the

capacitor. This is to minimize lateral movement.

250

200

150

100

50

TIME (SECONDS)

0

50

100

150

200

250

300

350

RECOMMENDED REFLOW SOLDERING PROFILE

GUIDE TO APPLICATION (Continued)

PAD

CASE

WIDTH

METALIZATION

SEPARATION

CODE

(A)

(B)

(C)

A

0.65

0.050

0.040

(1.6)

(1.3)

(1.0)

B

0.065

0.070

0.055

(1.6)

(1.8)

(1.4)

C

0.065

0.070

0.120

(1.6)

(1.8)

(0.3)

D

0.115

0.070

0.070

(2.9)

(1.8)

(1.8)

E

0.115

0.070

0.120

(2.9)

(1.8)

(3.0)

F

0.150

0.070

0.140

(3.8)

(1.8)

(3.6)

G

0.125

0.070

0.170

(3.2)

(1.8)

(4.3)

H

0.165

0.090

0.170

(4.2)

(2.3)

(4.3)

B

C

B

A