AD9215 datasheet(33/36 Pages) AD

33 / 36 page

AD9215

Rev. A | Page 33 of 36

OUTLINE DIMENSIONS

8°

0°

COMPLIANT TO JEDEC STANDARDS MO-153AE

SEATING

PLANE

COPLANARITY

0.10

1.20 MAX

6.40 BSC

0.65

BSC

PIN 1

0.30

0.19

0.20

0.09

4.50

4.40

4.30

0.75

0.60

0.45

9.80

9.70

9.60

0.15

0.05

Figure 59. 28-Lead Thin Shrink Small Outline Package [TSSOP]

(RU-28)

Dimensions shown in millimeters

COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2

0.30

0.23

0.18

0.20 REF

0.80 MAX

0.65 TYP

0.05 MAX

0.02 NOM

12° MAX

1.00

0.85

0.80

SEATING

PLANE

COPLANARITY

0.08

BOTTOM

VIEW

0.50

0.40

0.30

3.50 REF

0.50

BSC

3.25

3.10 SQ

2.95

0.60 MAX

0.25 MIN

NOTE:

IT IS RECOMMENDED THAT THE EXPOSED PADDLE BE SOLDERED

TO THE GROUND PLANE FOR THE LFCSP PACKAGE. THERE IS AN

INCREASED RELIABILITY OF THE SOLDER JOINTS, AND THE MAXIMUM

THERMAL CAPABILITY OF THE PACKAGE IS ACHIEVED WITH THE

EXPOSED PADDLE SOLDERED TO THE CUSTOMER BOARD.

TOP

VIEW

PIN 1

INDICATOR

PIN 1

INDICATOR

5.00

BSC SQ

4.75

BSC SQ

Figure 60. 32-Lead Lead Frame Chip Scale Package [LFCSP]

(CP-32)

Dimensions shown in millimeters

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