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LAN89730 Datasheet(PDF) 211 Page - Microchip Technology

Part # LAN89730
Description  Implements Reduced Power Operating Modes
PDF  218 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

LAN89730 Datasheet(HTML) 211 Page - Microchip Technology

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 2013-2015 Microchip Technology Inc.
DS60001348A-page 211
LAN89730
RECOMMENDED LAND PATTERN
Dimension Limits
Units
C2
Optional Center Pad Width
Contact Pad Spacing
Optional Center Pad Length
Contact Pitch
Y2
X2
5.30
5.30
MILLIMETERS
0.50 BSC
MIN
E
MAX
7.90
Contact Pad Length (X56)
Contact Pad Width (X56)
Y1
X1
0.85
0.30
Microchip Technology Drawing C04-2374A
NOM
SILK SCREEN
1
2
20
C1
Contact Pad Spacing
7.90
Contact Pad to Center Pad (X52)
G1
0.20
Thermal Via Diameter
V
Thermal Via Pitch
EV
0.33
1.20
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
E
EV
EV
C2
C1
X2
Y2
ØV
Y1
G1
X1
56L Very Thin Quad Flat, No Lead Package (P6) - 8x8 mm Body [VQFN]
With 5.2x5.2 mm Exposed Pad; Punch Singulated



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