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LAN89730 Datasheet(PDF) 210 Page - Microchip Technology |
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LAN89730 Datasheet(HTML) 210 Page - Microchip Technology |
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210 / 218 page ![]() LAN89730 DS60001348A-page 210 2013-2015 Microchip Technology Inc. Microchip Technology Drawing C04-374A Sheet 2 of 2 Number of Terminals Overall Height Terminal Width Terminal Length Mold Cap Thickness Pitch Standoff Units Dimension Limits A1 A b A2 e L N 0.50 BSC 0.30 0.18 0.80 0.00 0.23 0.40 0.85 0.02 MILLIMETERS MIN NOM 56 0.50 0.30 0.90 0.05 MAX K- 0.70 - REF: Reference Dimension, usually without tolerance, for information purposes only. BSC: Basic Dimension. Theoretically exact value shown without tolerances. 1. 2. 3. Notes: Pin 1 visual index feature may vary, but must be located within the hatched area. Package is punch singulated Dimensioning and tolerancing per ASME Y14.5M Terminal-to-Exposed-Pad For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: Overall Width Overall Length Exposed Pad Width Exposed Pad Length D E2 D2 E 5.10 8.00 BSC 5.20 8.00 BSC 5.30 D1 E1 Molded Top Width Molded Top Length 7.65 7.65 7.75 7.75 7.85 7.85 - - 0.70 5.10 5.20 5.30 56L Very Thin Quad Flat, No Lead Package (P6) - 8x8 mm Body [VQFN] With 5.2x5.2 mm Exposed Pad; Punch Singulated |
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