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LAN89730 Datasheet(PDF) 206 Page - Microchip Technology |
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LAN89730 Datasheet(HTML) 206 Page - Microchip Technology |
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206 / 218 page ![]() LAN89730 DS60001348A-page 206 2013-2015 Microchip Technology Inc. 7.7 Clock Circuit The device can accept either a 25 MHz crystal (preferred) or a 25 MHz single-ended clock oscillator (+/-50ppm) input. If the single-ended clock oscillator method is implemented, XO should be left unconnected and XI should be driven with a nominal 0-3.3 V clock signal. The input clock duty cycle is 40% minimum, 50% typical and 60% maximum. It is recommended that a crystal utilizing matching parallel load capacitors be used for the crystal input/output signals (XI/XO). Either a 300 µW or 100 µW 25 MHz crystal may be utilized. The 300 µW 25 MHz crystal specifications are detailed in Section 7.7.1. The 100 µW 25 MHz crystal specifications are detailed in Section 7.7.2. 7.7.1 300 µW 25 MHZ CRYSTAL SPECIFICATIONS When utilizing a 300 µW 25 MHz crystal, the following circuit design (Figure 7-9) and specifications (Table 7-22) are required to ensure proper operation. FIGURE 7-9: 300 µW 25 MHZ CRYSTAL CIRCUIT TABLE 7-22: 300 µW CRYSTAL SPECIFICATIONS Parameter Symbol Min. Nom. Max. Unit Note Crystal Cut AT, typ Crystal Oscillation Mode Fundamental Mode Crystal Calibration Mode Parallel Resonant Mode Frequency Ffund - 25.000 - MHz Frequency Tolerance @ 25oCFtol - - +/-50 PPM Note 7-14 Frequency Stability Over Temp Ftemp - - +/-50 PPM Note 7-14 Frequency Deviation Over Time Fage - +/-3 to 5 - PPM Note 7-15 Total Allowable PPM Budget - - +/-50 PPM Note 7-16 Shunt Capacitance CO - 7 typ - pF Load Capacitance CL - 20 typ - pF Drive Level PW 300 - - µW Equivalent Series Resistance R1 - - 50 Ohm Operating Temperature Range -40 - +105 oC XI Pin Capacitance - 3 typ - pF Note 7-17 XO Pin Capacitance - 3 typ - pF Note 7-17 LAN89730 XO XI Y1 C1 C2 |
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