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LAN89730 Datasheet(PDF) 207 Page - Microchip Technology |
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LAN89730 Datasheet(HTML) 207 Page - Microchip Technology |
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207 / 218 page ![]() 2013-2015 Microchip Technology Inc. DS60001348A-page 207 LAN89730 7.7.2 100 µW 25 MHZ CRYSTAL SPECIFICATIONS When utilizing a 100 µW 25 MHz crystal, the following circuit design (Figure 7-10) and specifications (Table 7-23) are required to ensure proper operation. Note 7-14 The maximum allowable values for frequency tolerance and frequency stability are application dependent. Since any particular application must meet the IEEE +/-50 PPM Total PPM Budget, the combination of these two values must be approximately +/-45 PPM (allowing for aging). Note 7-15 Frequency Deviation Over Time is also referred to as Aging. Note 7-16 The total deviation for the Transmitter Clock Frequency is specified by IEEE 802.3u as +/-50 PPM. Note 7-17 This number includes the pad, the bond wire and the lead frame. PCB capacitance is not included in this value. The XO/XI pin and PCB capacitance values are required to accurately calculate the value of the two external load capacitors. These two external load capacitors determine the accuracy of the 25.000 MHz frequency. FIGURE 7-10: 100 µW 25 MHZ CRYSTAL CIRCUIT TABLE 7-23: 100 µW CRYSTAL SPECIFICATIONS Parameter Symbol Min. Nom. Max. Unit Note Crystal Cut AT, typ Crystal Oscillation Mode Fundamental Mode Crystal Calibration Mode Parallel Resonant Mode Frequency Ffund - 25.000 - MHz Frequency Tolerance @ 25oCFtol - - +/-50 PPM Note 7-14 Frequency Stability Over Temp Ftemp - - +/-50 PPM Note 7-14 Frequency Deviation Over Time Fage - +/-3 to 5 - PPM Note 7-15 Total Allowable PPM Budget - - +/-50 PPM Note 7-16 Shunt Capacitance CO -- 5 pF Load Capacitance CL 8 - 12 pF Drive Level PW - 100 µW Equivalent Series Resistance R1 - - 80 Ohm XO Series Resistor RS 495 500 505 Ohm Operating Temperature Range -40 - +105 oC XI Pin Capacitance - 3 typ - pF Note 7-17 XO Pin Capacitance - 3 typ - pF Note 7-17 LAN89730 XO XI RS Y1 C1 C2 |
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