HAL114 datasheet(5/9 Pages) MICRONAS

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HAL114

MICRONAS INTERMETALL

Electrical Characteristics, continued

Symbol

Parameter

Pin No.

Min.

Typ.

Max.

Unit

Test Conditions

IOH

Output Leakage Current over

Temperature Range

–

µA

B < Boff

VOH = 24 V, TJ < 150 °C

IDD

Supply Current

8.2

TJ = 25 °C

IDD

Supply Current over

Temperature Range

3.9

8.2

ten(O)

Enable Time of Output

after Setting of VDD

–

µs

VDD = 12 V

Output Rise Time

–

400

VDD = 12 V, RL = 820 Ohm,

CL = 20 pF

Output Fall Time

–

400

VDD = 12 V, RL = 820 Ohm,

CL = 20 pF

RthJSB

case

SOT-89A

Thermal Resistance Junction to

Substrate Backside

–

150

200

K/W

Fiberglass Substrate

pad size see Fig. 6

RthJA

case

TO-92UA

Thermal Resistance

Junction to Soldering Point

–

150

200

K/W

Leads at ambient tempera-

ture at a distance of 2 mm

from case

Magnetic Characteristics at TJ = –40 °C to +170 °C, VDD = 4.5 V to 24 V,

Typical Characteristics for VDD = 12 V

Magnetic flux density values of switching points.

Positive flux density values refer to the magnetic south pole at the branded side of the package.

Parameter

–40

°C

100

°C

170

°C

Unit

Min.

Typ.

Max.

Min.

Typ.

Max.

Min.

Typ.

Max.

Min.

Typ.

Max.

On point BON

7.5

21.5

36.0

7.0

21.3

34.0

6.3

19.6

31.5

6.0

19.2

31.0

Off point BOFF

4.3

17.4

33.2

4.0

17.6

31.2

3.6

16.1

28.9

3.6

15.8

28.8

Hysteresis BHYS

2.8

4.1

5.0

2.8

3.7

4.5

2.6

3.5

4.0

2.2

3.4

4.0

BOFF min

BON max

BHYS

Output Voltage

Fig. 5: Definition of switching points and hysteresis

BOFF

BON

Fig. 6: Recommended pad size SOT-89A

Dimensions in mm

5.0

2.0

1.0

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