HAL114 datasheet(8/9 Pages) MICRONAS

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HAL114

MICRONAS INTERMETALL

–50

100

150

200

µA

IOH

°C

–1

–2

–3

–4

VOH = 24 V

VDD = 5 V

Fig. 15: Typical output leakage current

versus temperature

Application Note

For electromagnetic immunity, it is recommended to ap-

ply a 330 pF minimum capacitor between VDD (pin 1)

and Ground (pin 2).

For applications requiring robustness to conducted dis-

turbances (transients), a 220

Ω series resistor to pin 1

and a 4.7 nF capacitor between VDD (pin1) and Ground

(pin 2) is recommended. The series resistor and the ca-

pacitor should be placed as close as possible to the IC.

OUT

GND

1VDD

4.7 nF

VDD

220

Ω

Fig. 16: Recommended application circuit

Ambient Temperature

Due to the internal power dissipation, the temperature

on the silicon chip (junction temperature TJ) is higher

than the temperature outside the package (ambient tem-

perature TA).

TJ = TA + ∆T

At static conditions, the following equations are valid:

– for SOT-89A:

∆T = IDD * VDD * RthJSB

– for TO-92UA:

∆T = IDD * VDD * RthJA

For typical values, use the typical parameters. For worst

case calculation, use the max. parameters for IDD and

Rth, and the max. value for VDD from the application.

Data Sheet History

1. Final data sheet: “HAL114 Unipolar Hall Switch IC”,

June 10, 1998, 6251-456-1DS. First release of the final

data sheet.

MICRONAS INTERMETALL GmbH

Hans-Bunte-Strasse 19

D-79108 Freiburg (Germany)

P.O. Box 840

D-79008 Freiburg (Germany)

Tel. +49-761-517-0

Fax +49-761-517-2174

E-mail: docservice@intermetall.de

Internet: http://www.intermetall.de

Printed in Germany

by Systemdruck+Verlags-GmbH, Freiburg (06/98)

Order No. 6251-456-1DS

All information and data contained in this data sheet are with-

out any commitment, are not to be considered as an offer for

conclusion of a contract nor shall they be construed as to

create any liability. Any new issue of this data sheet invalidates

previous issues. Product availability and delivery dates are ex-

clusively subject to our respective order confirmation form; the

same applies to orders based on development samples deliv-

ered. By this publication, MICRONAS INTERMETALL GmbH

does not assume responsibility for patent infringements or

other rights of third parties which may result from its use.

Reprinting is generally permitted, indicating the source. How-

ever, our prior consent must be obtained in all cases.

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