1997 Oct 14

7

Philips Semiconductors

Product specification

UHF power transistor

BLT71/8

List of components (see Figs 6 and 7).

Notes

1. American Technical Ceramics type 100A or capacitor of same quality.

2. Tekelec Giga-trim, type 37271.

3. The striplines are on a double copper-clad printed-circuit board, with DUROID dielectric (

ε

thickness 0.79 mm, thickness of the copper sheet 2 x 35

µm.

COMPONENT

DESCRIPTION

VALUE

DIMENSIONS

CATALOGUE

NO.

C1, C12,

C13, C15

multilayer ceramic chip capacitor; note 1

120 pF

C2, C4, C8,

C10

Giga-Trim capacitor; note 2

0.6 to 4.5 pF

C3

multilayer ceramic chip capacitor; note 1

4.7 pF

C5

multilayer ceramic chip capacitor; note 1

5.6 pF

C6

multilayer ceramic chip capacitor; note 1

3.9 pF

C7

multilayer ceramic chip capacitor; note 1

6.8 pF

C9

multilayer ceramic chip capacitor; note 1

7.5 pF

C11

multilayer ceramic chip capacitor; note 1

5.1 pF

C14, C16

multilayer ceramic chip capacitor; note 1

10 nF

L1, L10

stripline; note 3

50

Ω

10 x 2.4 mm

L2

stripline; note 3

50

Ω

2 x 2.4 mm

L3

stripline; note 3

50

Ω

30.4 x 2.4 mm

L4

stripline; note 3

50

Ω

17.4 x 2.4 mm

L5

stripline; note 3

50

Ω

6.8 x 2.4 mm

L6

stripline; note 3

50

Ω

8 x 2.4 mm

L7

stripline; note 3

50

Ω

19 x 2.4 mm

L8

stripline; note 3

50

Ω

28 x 2.4 mm

L9

stripline; note 3

50

Ω

1.6 x 2.4 mm

L11

10 turns 1 mm enamelled copper wire

140 nH

int. dia.=4mm;

lead 1 = 2.5 mm;

lead2=11mm

L12

2 turns 1 mm enamelled copper wire

60 nH

int. dia.=2mm;

leads=2x7.5 mm

L13, L14

4S2 wideband RF choke

4330 030 36301

R1

metal film resistor

1.4 k

Ω; 0.6 W

2322 156 11402

R2, R3, R4

metal film resistor

10

Ω; 0.6 W

2322 156 11009

TR1

device under test

BLT71/8

TR2

NPN transistor

BD139

9330 912 20112