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BLT71 Datasheet(PDF) 3 Page - NXP Semiconductors |
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BLT71 Datasheet(HTML) 3 Page - NXP Semiconductors |
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3 / 12 page ![]() 1997 Oct 14 3 Philips Semiconductors Product specification UHF power transistor BLT71/8 THERMAL CHARACTERISTICS Note 1. Ts is the temperature at the soldering point of the collector pin. CHARACTERISTICS Tj =25 °C unless otherwise specified. SYMBOL PARAMETER CONDITIONS MAX. UNIT Rth j-s thermal resistance from junction to soldering point Pdis = 2.9 W; Ts =60 °C; note 1 40 K/W SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT V(BR)CBO collector-base breakdown voltage open emitter; IC = 0.5 mA 16 − V V(BR)CEO collector-emitter breakdown voltage open base; IC =10mA 8 − V V(BR)EBO emitter-base breakdown voltage open collector; IE = 0.1 mA 2.5 − V ICES collector leakage current VCE =8V; VBE =0 − 0.1 mA hFE DC current gain VCE =5V; IC = 100 mA 25 − Cc collector capacitance VCB = 4.8 V; IE =ie = 0; f = 1 MHz − 7pF Cre feedback capacitance VCE = 4.8 V; IC = 0; f = 1 MHz − 5pF Fig.2 DC SOAR. Ts = 115 °C. handbook, halfpage 1 10−1 MBK263 10−1 110 IC (A) VCE (V) 102 (1) Fig.3 DC current gain as a function of collector current; typical values. VCE = 4.8 V. Measured under pulse conditions: tp ≤ 300 µs; δ≤ 0.001. handbook, halfpage 0 100 50 150 0 200 400 600 800 hFE IC (mA) MLD131 |
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