PS2861-1

1. Recommended Soldering Conditions

Recommended Temperature Profile of Infrared Reflow

(1) Infrared reflow soldering

• Peak reflow temperature

235 ûC (package surface temperature)

• Time of temperature higher than 210 ûC

30 seconds or less

• Number of reflows

Three

• Flux

Rosin flux containing small amount of chlorine (The flux

with a maximum chlorine content of 0.2 Wt % is

recommended).

(2) Dip soldering

• Temperature

260 ûC or below (molten solder temperature)

• Time

10 seconds or less

• Number of times

One (allowed to be dipped in solder including plastic mold portion)

• Flux

Rosin flux containing small amount of chlorine (The flux

with a maximum chlorine content of 0.2 Wt % is recommended).

(3) Cautions

• Fluxes

Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.

2. Cautions regarding noise

Be aware that when voltage is applied suddenly between the photocoupler's input and output or between collector -emitters

at startup, the output side may enter the on state, even if the voltage is within the absolute maximum ratings.

Time (s)

100 to 160 ûC

60 to 120 s

(preheating)

(heating)

to 10 s

to 30 s

235 ûC (peak temperature)

210 ûC

Life Support Applications

These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably

be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and

agree to fully indemnify CEL for all damages resulting from such improper use or sale.

A Business Partner of NEC Compound Semiconductor Devices, Ltd.

10/14/2003