LMX9820 datasheet(7/40 Pages) NSC

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Revision 1.0

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5.0 Pad Descriptions (Continued)

PH3_TP9

F13

Testpin

Module Test Point.1

PH2_TP8

G13

Testpin

Module Test Point.1

Treat as No Connect, Pad required for mechanical stability.

Table 8. Power, Ground, and No Connect Signals

Pad Name

Pad

Location

Direction

Description

A1, A2, A3, A4, A5,

A6, A7, B1, C1, D1,

D13, E1, E13, F1,

G1, G7, H1, H4, J1,

J3, J6, J7, J9, J10,

J11

not

connected

No Connect. Must have pad for mechanical stability.

RF GND1

B2, B3, B4, B5, B6,

B7, C2, C3, C4, C5,

C6, C7, D2, D3, D4,

D5, D6, D7, E2, E3,

E4, E5, E6, E7, F2,

F3, F4, F5, F6, F7,

G2, G3, G4, G5,

G6, H5, H6, H7, H9,

H10, H11

Input

Radio System Ground. Must be connected to RF Ground

plane. Thermal relief required for proper soldering.

Dig_gnd_11

D12

Input

Digital Ground.

Dig_gnd_21

G11

Input

Digital Ground.

VCC

Input

2.85V to 3.6V Input for the Internal Power Supply Reg-

ulators.

VDD_ANA_OUT

Output

Voltage Regulator Output/Power Supply for Analog

Circuitry. If not used, place pad and do not connect to VCC

or Ground.

VDD_DIG_OUT

Output

Voltage Regulator Output/Power Supply for Digital Cir-

cuitry. If not used, place pad and do not connect to VCC or

Ground.

VDD_DIG_PWR

_D#

Input

Power Down for the Internal Power Supply Regulator

for the Digital Circuitry. Place pad and do not connect to

VCC or Ground.

Connect RF GND, Dig_gnd_1, and Dig_gnd_2 to single Ground plane.

Table 7. Test Interface Signals (Continued)

Pad Name

Pad

Location

Direction

Description

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