LM3211 datasheet(6/21 Pages) NSC

6 / 21 page

Electrical Characteristics

Specifications in standard type face are for T

J = 25˚C and those with boldface type apply over the full Operating Tempera-

ture Range (T

J = −40˚C to +125˚C). Unless otherwise specified, VIN =2.2V and Vs+ = 8V.

BUFFERS

Symbol

Parameter

Conditions

Min

(Note 4)

Typ

(Note 5)

Max

(Note 4)

Units

Input offset voltage

2.5

∆V

os/

∆T

Offset Voltage Drift

µV/˚C

Input Bias Current

170

800

CMVR

Input Common-mode Voltage

Range

0.05

Vs+-0.05

Input Impedance

400

Ω

Input Capacitance

OUT

Continuous Output Current

Vs+=8V, Source

Vs+=8V, Sink

−45

−37

−27

Vs+=12V, Source

Vs+=12V, Sink

−54

−44

−32

OUT Swing

L=10k, Vo min.

0.075

L=10k, Vo max.

7.88

L=2k, Vo min.

0.075

L=2k, Vo max.

7.85

VCL

Voltage Gain

L =2 k

Ω

L=10 k

Ω

0.994

0.9985

0.998

0.9999

V/V

Gain Linearity

L =2 k

Ω, Buffer input=0.5 to

(Vs+-0.5V)

0.01

Vs+

Supply Voltage

412

PSRR

Power Supply Rejection

Ratio

Vs+=4to12V

316

µV/V

Is+

Supply Current/Amplifier

Vo = Vs+/2, No Load

0.75

1.2

Slew Rate

L =150pf

5.3

V/µs

Bandwidth

-3dB,R

L =10 k

Ω,C

L =100pf

MHz

Phase Margin

L =100pf

Deg˚

Note 1: The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal resistance, θJA,

and the ambient temperature, TA. See the Electrical Characteristics table for the thermal resistance of various layouts. The maximum allowable power dissipation

at any ambient temperature is calculated using: PD (MAX) = (TJ(MAX) −TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die

temperature, and the regulator will go into thermal shutdown.

Note 2: Absolute maximum ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions for which the device is intended to

be functional, but device parameter specifications may not be guaranteed. For guaranteed specifications and test conditions, see the Electrical Characteristics.

Note 3: The human body model is a 100 pF capacitor discharged through a 1.5k

Ω resistor into each pin. The machine model is a 200pF capacitor discharged

directly into each pin.

Note 4: All limits guaranteed at room temperature (standard typeface) and at temperature extremes (bold typeface). All room temperature limits are 100%

production tested or guaranteed through statistical analysis. All limits at temperature extremes are guaranteed via correlation using standard Statistical Quality

Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL).

Note 5: Typical numbers are at 25˚C and represent the most likely norm.

Note 6: Duty cycle affects current limit due to ramp generator. See Switch Current Limit vs. VIN and Switch Current Limit vs. Temperature graphs in the Typical

Performance Characteristics section.

Note 7: See Typical Performance Characteristics section for Tri-Temperature data for RDSON vs. VIN.

Note 8: Bias current flows into FB pin.

LM3211 Datasheet(PDF) 6 Page - National Semiconductor (TI)

LM3211 Datasheet(HTML) 6 Page - National Semiconductor (TI)

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21

Datasheet Download

Link URL