32-Channel, 16-Bit, Voltage-Output

DACs with Serial Interface

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25

Selector Guide

PART

INL (MAX LSB)

OUTPUT VOLTAGE

RANGE (V)

MAX5732ACTN

±8

0 to +5

MAX5732BCTN

±16

0 to +5

MAX5732CCTN

±64

0 to +5

MAX5732AETN

±8

0 to +5

MAX5732BETN

±16

0 to +5

MAX5732CETN

±64

0 to +5

MAX5733ACTN

±8

0 to +10

MAX5733BCTN

±16

0 to +10

MAX5733CCTN

±64

0 to +10

MAX5733AETN

±8

0 to +10

MAX5733BETN

±16

0 to +10

MAX5733CETN

±64

0 to +10

MAX5734ACTN

±8

-2.5 to +7.5

MAX5734BCTN

±16

-2.5 to +7.5

MAX5734CCTN

±64

-2.5 to +7.5

MAX5734AETN

±8

-2.5 to +7.5

MAX5734BETN

±16

-2.5 to +7.5

MAX5734CETN

±64

-2.5 to +7.5

MAX5735ACTN

±8

-5 to +5

MAX5735BCTN

±16

-5 to +5

MAX5735CCTN

±64

-5 to +5

MAX5735AETN

±8

-5 to +5

MAX5735BETN

±16

-5 to +5

MAX5735CETN

±64

-5 to +5

Pin Configuration

TOP VIEW

MAX5732

MAX5733

MAX5734

MAX5735

OUT3

AGND

OUT4

OUT5

OUT6

OUT0

OUT1

OUT2

N.C.

OUT7

OUT8

OUT9

11

10

9

8

7

6

5

4

3

2

14

13

12

1

EXPOSED PADDLE

8mm x 8mm THIN QFN-EP

20

19

18

17

16

24

23

22

21

15

26

25

28

27

29

30

31

32

33

34

35

36

37

38

AGND

OUT23

OUT24

OUT25

OUT26

OUT27

OUT28

OUT29

OUT30

OUT31

39

40

41

OUT21

OUT22

42

46

47

48

49

50

43

44

45

51

52

53

54

55

56

Chip Information

TRANSISTOR COUNT: 152,000

PROCESS: BiCMOS

breakdown voltages. Some devices require external

protection on their reference inputs to satisfy absolute

maximum ratings. The MAX5734 features outputs that

supplies to be set to voltages within the absolute maxi-

mum ratings of the PEIC. This guarantees that the PEIC

is protected in all situations.

Additional protection is provided by the MAX5734

glitch-free power-up into the clear state with all DAC

outputs set to approximately 0V. Either the serial port or

the

CLR input can assert the clear function.

Power Supplies, Bypassing,

Decoupling, and Layout

Grounding and power-supply decoupling strongly influ-

ence device performance. Digital signals can couple

through the reference input, power supplies, and ground

connection. Proper grounding and layout can reduce

digital feedthrough and crosstalk. Bypass all power sup-

plies with an additional 0.1µF and 1µF on each pin, as

close to the device as possible. Refer to the MAX5732–

MAX5735 evaluation kit for a suggested layout.

The MAX5732–MAX5735 have four separate power

output buffers.

The MAX5732–MAX5735 feature an exposed paddle on

the backside of the package for improved power dissi-

pation. The exposed paddle is electrically connected to

that shares the same potential. For more information on

the exposed paddle QFN package, refer to the following

website: http://pdfserv.maxim-ic.com/arpdf/AppNotes/

4hfan081.pdf