PACKAGE OPTION ADDENDUM

www.ti.com

16-May-2017

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device

Status

(1)

Package Type Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C)

Device Marking

(4/5)

Samples

TLV803MDBZR

ACTIVE

SOT-23

DBZ

3

3000

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

VOUQ

TLV803MDBZT

ACTIVE

SOT-23

DBZ

3

250

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

VOUQ

TLV803RDBZR

ACTIVE

SOT-23

DBZ

3

3000

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

VOSQ

TLV803RDBZT

ACTIVE

SOT-23

DBZ

3

250

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

VOSQ

TLV803SDBZR

ACTIVE

SOT-23

DBZ

3

3000

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

VOTQ

TLV803SDBZT

ACTIVE

SOT-23

DBZ

3

250

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

VOTQ

TLV803ZDBZR

ACTIVE

SOT-23

DBZ

3

3000

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

VORQ

TLV803ZDBZT

ACTIVE

SOT-23

DBZ

3

250

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

VORQ

TLV853MDBZR

ACTIVE

SOT-23

DBZ

3

3000

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

ZGM4

TLV853MDBZT

ACTIVE

SOT-23

DBZ

3

250

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

ZGM4

TLV863MDBZR

ACTIVE

SOT-23

DBZ

3

3000

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

VTWM

TLV863MDBZT

ACTIVE

SOT-23

DBZ

3

250

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 125

VTWM

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.